Abstract: Methods for integrating wide-gap semiconductors with synthetic diamond substrates are disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure including at least one layer of gallium nitride, aluminum nitride, silicon carbide, or zinc oxide. The resulting structure is a low stress process compatible with wide-gap semiconductor films, and may be processed into optical or high-power electronic devices. The diamond substrates serve as heat sinks or mechanical substrates.

Abstract: A communications adaptor card is disclosed herein. One embodiment of the communications adaptor card comprises, a printed-circuit board, the printed circuit board having at least one keep-out area, the at least one keep-out area configured to accept a multi-contact electrical connector receptacle and at least one optical module attached to the printed circuit board. The at least one optical module can be attached to the printed circuit board substantially within the at-least-one keep-out area.

Abstract: Method for producing composite wafers with thin high-quality semiconductor films atomically attached to synthetic diamond wafers is disclosed. Synthetic diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited on bulk semiconductor wafer which has been prepared to allow separation of the thin semiconductor film from the remaining bulk semiconductor wafer. The remaining semiconductor wafer is available for reuse. The synthetic diamond substrate serves as heat spreader and a mechanical substrate.

Abstract: A method for making diamond heat sinks where the diamond is smooth and is not bowed. Smooth diamond is created by depositing synthetic diamond onto a smooth substrate. The substrate subsequently removed revealing a diamond surface that is smooth. Bow in the diamond layers resulting from intrinsic stress can be reduced by bonding two diamond films with similar intrinsic stress with the final growth surfaces facing each other.

Abstract: Methods for integrating wide-gap semiconductors with synthetic diamond substrates are disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure including at least one layer of gallium nitride, aluminum nitride, silicon carbide, or zinc oxide. The resulting structure is a low stress process compatible with wide-gap semiconductor films, and may be processed into optical or high-power electronic devices. The diamond substrates serve as heat sinks or mechanical substrates.

Abstract: A surface emitting semiconductor laser system having four cavities that couple light from a single aperture. Each of the four cavities overlaps at the outcoupling aperture. Each cavity is fabricated to resonate at a different central wavelength, outputting a different frequency of light, each of which can be independently modulated.

Abstract: A surface emitting semiconductor laser system having four cavities that couple light from a single aperture. Each of the four cavities overlaps at the outcoupling aperture. Each cavity is fabricated to resonate at a different central wavelength, outputting a different frequency of light, each of which can be independently modulated.

Abstract: An improved electromagnetic interference shield for a module includes springs in which the compression force pushes the springs in a direction that is approximately parallel to the optic axis. The springs allow significantly looser tolerances on the placement of the module on its associated printed circuit board. The shield also includes an opening near its center, the edge of which includes a plurality of teeth. When the shield is placed onto the module, the teeth bend along the negative optic axis direction and prevent the shield from being pulled away from the module. Accidental removal of the shield is thus prevented. The shield splits the enclosure ground from the internal signal ground, decreasing the capacitance between them, in turn decreasing another possible source of electromagnetic radiation. In addition, the shield is more cost efficient to manufacture since it only requires a one step assembly process.

Abstract: An improved electromagnetic interference shield for a module includes springs in which the compression force pushes the springs in a direction that is approximately parallel to the optic axis. The springs allow significantly looser tolerances on the placement of the module on its associated printed circuit board. The shield also includes an opening near its center, the edge of which includes a plurality of teeth. When the shield is placed onto the module, the teeth bend along the negative optic axis direction and prevent the shield from being pulled away from the module. Accidental removal of the shield is thus prevented. The shield splits the enclosure ground from the internal signal ground, decreasing the capacitance between them, in turn decreasing another possible source of electromagnetic radiation. In addition, the shield is more cost efficient to manufacture since it only requires a one step assembly process.

Abstract: An integrated and modular coupling module for coupling light between optical devices, such as an optical fiber connector and optoelectronic device, is presented. In this invention, beam-shaping elements and alignment elements are integrated on a single alignment plate in such a way that they maintain a precise physical relationship. The relative physical arrangement between the beam-shaping elements and the alignment elements are configured such that once the alignment elements are engaged with the peripheral devices, accurate optical alignment between the peripheral devices and the coupling module is also attained. The optical coupling module of the present invention enables it to withstand temperatures of 220° C. or higher while maintaining its integrity and performance. The principle of the present invention can also be extended to constructing coupling modules for coupling other types of electromagnetic radiation.

Abstract: This invention provides an integrated and modular coupling module for coupling light between optical devices, such as an optical fiber connector and optoelectronic device. In a coupling module of the present invention, beam-shaping elements and alignment elements are integrated on a single alignment plate in such a way that they maintain a precise physical relationship. Moreover, the relative physical arrangement between the beam-shaping elements and the alignment elements are configured such that once the alignment elements are engaged with the peripheral devices, accurate optical alignment between the peripheral devices and the coupling module is also attained. The beam-shaping elements, such as optical lenses, are securely embedded in the alignment plate. The alignment elements, typically in the form of alignment pins and holes, are produced on the alignment plate in such a way that they effectively become an integral part of the alignment plate.

Abstract: An array of n-wavelength vertical cavity surface emitting lasers (VCSELs) can be grown with precise and repeatable wavelength control. First, a foundation VCSEL structure is grown on a substrate. Next, n-paired layers of AlGaAs and InGaP are grown, where n is the desired number of different wavelengths. Next, one of the n regions is masked and etched. The steps of masking and etching are repeated until all n regions are etched. Finally, the upper VCSEL structure is grown.

Abstract: An array of n-wavelength vertical cavity surface emitting lasers (VCSELs) can be grown with precise and repeatable wavelength control. First, a foundation VCSEL structure is grown on a substrate. Next, n-paired layers of AlGaAs and InGaP are grown, where n is the desired number of different wavelengths. Next, one of the n regions is masked and etched. The steps of masking and etching are repeated until all n regions are etched. Finally, the upper VCSEL structure is grown.