Patents by Inventor Dudi I. Amir

Dudi I. Amir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7538440
    Abstract: A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: May 26, 2009
    Assignee: Intel Corporation
    Inventors: Dudi I. Amir, Damion T. Searls
  • Patent number: 7185799
    Abstract: Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so that, upon reflow to the circuit board the solder balls combine, creating a larger solder connection. Signal solder balls, however, remain separated. The power or ground solder balls on a particular bond pad are separated from one another by portions of a removable solder mask that keep the solder balls spherical in shape during solder ball attachment to the electronic package. However, it is removed prior to reflow to the circuit board, thus creating a larger, longer solder connection between the electronic package and circuit board.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: March 6, 2007
    Assignee: Intel Corporation
    Inventors: Tom E. Pearson, Dudi I. Amir, Terrance J. Dishongh
  • Publication number: 20040216917
    Abstract: A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.
    Type: Application
    Filed: April 30, 2003
    Publication date: November 4, 2004
    Inventors: Dudi I. Amir, Damion T. Searls