Patents by Inventor Duk Hyun CHUN

Duk Hyun CHUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11901130
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo Park, Myung Jun Park, Hyun Hee Gu, Bum Soo Kim, Yeon Song Kang, Duk Hyun Chun, Chung Eun Lee
  • Publication number: 20230154684
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Application
    Filed: January 17, 2023
    Publication date: May 18, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo PARK, Myung Jun PARK, Hyun Hee GU, Bum Soo KIM, Yeon Song KANG, Duk Hyun CHUN, Chung Eun LEE
  • Patent number: 11587735
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: February 21, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo Park, Myung Jun Park, Hyun Hee Gu, Bum Soo Kim, Yeon Song Kang, Duk Hyun Chun, Chung Eun Lee
  • Patent number: 11476051
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode and including a first conductive layer and a first band portion, and a second external electrode connected to the second internal electrode and including a second conductive layer and a second band portion. Tb/Tc is 0.85 or more, where Tc is a maximum thickness of each of the first and second conductive layers and Tb is a maximum thickness of each of the first and second band portions.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Bum Soo Kim, Jin Soo Park, Duk Hyun Chun, Myung Jun Park, Yeon Song Kang, Jong Ho Lee, Hyun Hee Gu
  • Publication number: 20210265114
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 26, 2021
    Inventors: Jin Soo PARK, Myung Jun PARK, Hyun Hee GU, Bum Soo KIM, Yeon Song KANG, Duk Hyun CHUN, Chung Eun LEE
  • Publication number: 20210217560
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode and including a first conductive layer and a first band portion, and a second external electrode connected to the second internal electrode and including a second conductive layer and a second band portion. Tb/Tc is 0.85 or more, where Tc is a maximum thickness of each of the first and second conductive layers and Tb is a maximum thickness of each of the first and second band portions.
    Type: Application
    Filed: April 16, 2020
    Publication date: July 15, 2021
    Inventors: Bum Soo KIM, Jin Soo PARK, Duk Hyun CHUN, Myung Jun PARK, Yeon Song KANG, Jong Ho LEE, Hyun Hee GU
  • Patent number: 10861651
    Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer, and an external electrode disposed on the body. The external electrode includes a first electrode layer contacting the internal electrode, an oxide layer disposed on the first electrode layer and including a metal oxide and glass, and a second electrode layer disposed on the oxide layer.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Duk Hyun Chun, Myung Jun Park, Eun Jin Kim, Hye Min Bang
  • Publication number: 20190341190
    Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer, and an external electrode disposed on the body. The external electrode includes a first electrode layer contacting the internal electrode, an oxide layer disposed on the first electrode layer and including a metal oxide and glass, and a second electrode layer disposed on the oxide layer.
    Type: Application
    Filed: October 9, 2018
    Publication date: November 7, 2019
    Inventors: Jong Ho LEE, Duk Hyun CHUN, Myung Jun PARK, Eun Jin KIM, Hye Min BANG
  • Patent number: 9875849
    Abstract: A multilayer ceramic electronic component includes: a main body; and a first external electrode disposed on a first surface of the main body and a second external electrode disposed on a second surface of the main body. The first external electrodes include a first base electrode forming an edge portion of the first surface of the main body and a first terminal electrode disposed on a portion of the first base electrode. The second external electrodes include a second base electrode forming an edge portion of the second surface of the main body and a second terminal electrode disposed on a portion of the second base electrode.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: January 23, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Lee, Bong Jun Juhng, Duk Hyun Chun, Won Pyo Lee, Seung Hee Yoo, Myung Jun Park
  • Publication number: 20160351332
    Abstract: A multilayer ceramic electronic component includes: a main body; and a first external electrode disposed on a first surface of the main body and a second external electrode disposed on a second surface of the main body. The first external electrodes include a first base electrode forming an edge portion of the first surface of the main body and a first terminal electrode disposed on a portion of the first base electrode. The second external electrodes include a second base electrode forming an edge portion of the second surface of the main body and a second terminal electrode disposed on a portion of the second base electrode.
    Type: Application
    Filed: January 7, 2016
    Publication date: December 1, 2016
    Inventors: Jin Woo LEE, Bong Jun JUHNG, Duk Hyun CHUN, Won Pyo LEE, Seung Hee YOO, Myung Jun PARK
  • Patent number: 9240280
    Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second internal electrodes facing each other while having the dielectric layer disposed therebetween, and alternately exposed to end surfaces of the ceramic body; first and second external electrodes electrically connected to the first and second internal electrodes, wherein each of the first and second external electrodes includes a first external electrode layer formed of material containing copper and glass and extending from an end surface of the ceramic body to portions of main and side surfaces of the ceramic body; a second external electrode layer formed of material containing glass, disposed on the first external electrode layer, and being shorter than the first external electrode layer to expose portion of the first external electrode layer; and a third external electrode layer formed of material containing copper and glass and covering the first and second external electrode layers.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: January 19, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byong Gyun Kim, Duk Hyun Chun, Kyoung No Lee, Youn Sik Jin, Eun Sang Na, Doo Young Kim
  • Publication number: 20150085422
    Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second internal electrodes facing each other while having the dielectric layer disposed therebetween, and alternately exposed to end surfaces of the ceramic body; first and second external electrodes electrically connected to the first and second internal electrodes, wherein each of the first and second external electrodes includes a first external electrode layer formed of material containing copper and glass and extending from an end surface of the ceramic body to portions of main and side surfaces of the ceramic body; a second external electrode layer formed of material containing glass, disposed on the first external electrode layer, and being shorter than the first external electrode layer to expose portion of the first external electrode layer; and a third external electrode layer formed of material containing copper and glass and covering the first and second external electrode layers.
    Type: Application
    Filed: December 27, 2013
    Publication date: March 26, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byong Gyun KIM, Duk Hyun CHUN, Kyoung No LEE, Youn Sik JIN, Eun Sang NA, Doo Young KIM