Patents by Inventor Duk Kyu Lee

Duk Kyu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136674
    Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.
    Type: Application
    Filed: January 19, 2022
    Publication date: April 25, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Jong-Sik PARK, Jae-Won LIM, Yu-Sung CHOE, Hak-Kyun KIM, Je-Jun LEE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Pil-Kyu PARK, Kwang-Su HWANGBO, Do-Gyun KIM, Geon-Woo MIN, Hae-Jin LIM, Min-Ki JO, Su-Ji CHOI, Bo-Hyun KANG, Jae-Woong KIM, Ji-Min JUNG, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI
  • Patent number: 11950374
    Abstract: An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: April 2, 2024
    Assignee: KOH YOUNG TECHNOLOGY INC.
    Inventors: Duk Young Lee, Jae Hyung Kim, Jeong Kyu Noh
  • Patent number: 11909156
    Abstract: A connection structure for connecting a power cable and a conductor lead-out rod to minimize electrical resistance of a contact surface, and conductor connection device of a power cable may be provided with at least one conducting bolt configured to be fastened into a fastening hole to apply pressure to conductive particles injected into an accommodation space so as to electrically connect a conductor part and a conductor lead-out rod; and a fixing bolt configured to be fastened into the fastening hole to fix the conductor part inserted into an accommodation groove of the conductor lead-out rod.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: February 20, 2024
    Assignee: LS CABLE & SYSTEM LTD.
    Inventors: Duk Kyu Lee, Dong Yun Oh, Jung Jin Lee
  • Publication number: 20210050679
    Abstract: The present disclosure relates to a connection structure for connecting a power cable and a conductor lead-out rod to minimize electrical resistance of a contact surface, and conductor connection device of a power cable.
    Type: Application
    Filed: January 9, 2019
    Publication date: February 18, 2021
    Inventors: Duk Kyu LEE, Dong Yun OH, Jung Jin LEE
  • Patent number: 8723545
    Abstract: A probe card facilitates a wiring connection, reducing working time and preventing a working error and includes a main circuit board having an opening in its center. A reinforcement member has a lower end coupled to that opening to prevent deforming the board. A sub-circuit board electrically connected to the main board is seated on an upper side of the reinforcement member. A space transformer is positioned on a lower portion of the opening of the main board. A plurality of wires have both ends inserted into through holes in the sub-circuit board and space transformer to electrically connect them. Probes are provided on a lower portion of the space transformer, each having one end in contact with the wire inserted into the through-hole of the space transformer and the other end in contact with a wafer to be tested.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: May 13, 2014
    Assignee: SDA Co., Ltd.
    Inventors: Duk Kyu Lee, Chang Min Im, Sang Bum Sim, Yun Kee Cho
  • Patent number: 8603936
    Abstract: Disclosed herein is a light-responsive photocatalyst composition, which is a composite oxide semiconductor containing tungsten, and which can efficiently absorb visible light emitted from the sun and light emitted from interior lamps, such as fluorescent lamps, etc., and a method of preparing the light-responsive photocatalyst composition. The visible light-responsive photocatalyst composition can decompose volatile organic compounds or harmful organic matter causing sick house syndrome, even indoors, because it can be activated by visible light outdoors and can respond to light emitted from interior lamps, such as fluorescent lamps, etc.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: December 10, 2013
    Assignee: Seoul National University R&DB Foundation
    Inventors: In Sun Cho, Sang Wook Lee, Jun Hong Noh, Shin Tae Bae, Dong Wook Kim, Chin Moo Cho, Chae Hyun Kwak, Tae Hoon Noh, Duk Kyu Lee, Kug Sun Hong
  • Publication number: 20120146677
    Abstract: A probe card facilitates a wiring connection, reducing working time and preventing a working error and includes a main circuit board having an opening in its center. A reinforcement member has a lower end coupled to that opening to prevent deforming the board. A sub-circuit board electrically connected to the main board is seated on an upper side of the reinforcement member. A space transformer is positioned on a lower portion of the opening of the main board. A plurality of wires have both ends inserted into through holes in the sub-circuit board and space transformer to electrically connect them. Probes are provided on a lower portion of the space transformer, each having one end in contact with the wire inserted into the through-hole of the space transformer and the other end in contact with a wafer to be tested.
    Type: Application
    Filed: November 1, 2011
    Publication date: June 14, 2012
    Inventors: Duk Kyu Lee, Chang Min Im, Sang Bum Sim, Yun Kee Cho
  • Publication number: 20090192032
    Abstract: Disclosed herein is a light-responsive photocatalyst composition, which is a composite oxide semiconductor containing tungsten, and which can efficiently absorb visible light emitted from the sun and light emitted from interior lamps, such as fluorescent lamps, etc., and a method of preparing the light-responsive photocatalyst composition. The visible light-responsive photocatalyst composition can decompose volatile organic compounds or harmful organic matter causing sick house syndrome, even indoors, because it can be activated by visible light outdoors and can respond to light emitted from interior lamps, such as fluorescent lamps, etc.
    Type: Application
    Filed: March 26, 2008
    Publication date: July 30, 2009
    Applicant: Seoul National University Industry Foundation
    Inventors: In Sun Cho, Sang Wook Lee, Jun Hong Noh, Shin Tae Bae, Dong Wook Kim, Chin Moo Cho, Chae Hyun Kwak, Tae Hoon Noh, Duk Kyu Lee, Kug Sun Hong