Patents by Inventor Dukyong LEE
Dukyong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967540Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.Type: GrantFiled: December 1, 2021Date of Patent: April 23, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Seungwon Im, Oseob Jeon, Byoungok Lee, Yoonsoo Lee, Joonseo Son, Dukyong Lee, Changyoung Park
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Publication number: 20240088007Abstract: A package includes a first direct bonded metal (DBM) substrate, a first semiconductor die disposed on a top surface of the first DBM substrate, a second DBM substrate disposed at a height above the first DBM substrate, and a second semiconductor die disposed on a top surface of the second DBM substrate. A wire bond is made between the first semiconductor die disposed on the top surface of the first DBM substrate and the second semiconductor die disposed on the top surface of the second DBM substrate.Type: ApplicationFiled: September 13, 2022Publication date: March 14, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jonghwan BAEK, Jeonghyuk PARK, Seungwon IM, Keunhyuk LEE, Dukyong LEE
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Publication number: 20230230895Abstract: In one general aspect, an apparatus can include a first module including a first semiconductor die, and a first heatsink coupled to the first module where the first heatsink includes a substrate and a first plurality of protrusions. The apparatus can also include a second module including a second semiconductor die, and a second heatsink coupled to the second module and including a second plurality of protrusions. The apparatus can also include a cover defining a channel where the first plurality of protrusions of the first heatsink and the second plurality of protrusions of the second heatsink are disposed within the channel.Type: ApplicationFiled: March 20, 2023Publication date: July 20, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jerome TEYSSEYRE, Roveendra PAUL, Dukyong LEE
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Patent number: 11610832Abstract: In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus includes a cover defining a channel where the channel is outside of the module and the plurality of protrusions of the heatsink are disposed within the channel, and a sealing mechanism is disposed between the cover and the module is in contact with the module.Type: GrantFiled: May 14, 2020Date of Patent: March 21, 2023Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jerome Teysseyre, Roveendra Paul, Dukyong Lee
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Publication number: 20220093487Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.Type: ApplicationFiled: December 1, 2021Publication date: March 24, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Seungwon IM, Oseob JEON, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE, Changyoung PARK
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Patent number: 11201105Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.Type: GrantFiled: February 14, 2020Date of Patent: December 14, 2021Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Seungwon Im, Oseob Jeon, Byoungok Lee, Yoonsoo Lee, Joonseo Son, Dukyong Lee, Changyoung Park
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Publication number: 20200335414Abstract: In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus includes a cover defining a channel where the channel is outside of the module and the plurality of protrusions of the heatsink are disposed within the channel, and a sealing mechanism is disposed between the cover and the module is in contact with the module.Type: ApplicationFiled: May 14, 2020Publication date: October 22, 2020Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jerome TEYSSEYRE, Roveendra PAUL, Dukyong LEE
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Publication number: 20200185305Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.Type: ApplicationFiled: February 14, 2020Publication date: June 11, 2020Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Seungwon IM, Oseob JEON, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE, Changyoung PARK
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Patent number: 10665525Abstract: In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus can include a cover including a channel where the plurality of protrusions of the heatsink are disposed within the channel, and can include a sealing mechanism disposed between the cover and the module.Type: GrantFiled: May 1, 2018Date of Patent: May 26, 2020Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jerome Teysseyre, Roveendra Paul, Dukyong Lee
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Patent number: 10607919Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.Type: GrantFiled: September 25, 2017Date of Patent: March 31, 2020Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Seungwon Im, Oseob Jeon, Byoungok Lee, Yoonsoo Lee, Joonseo Son, Dukyong Lee, Changyoung Park
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Publication number: 20190341327Abstract: In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus can include a cover including a channel where the plurality of protrusions of the heatsink are disposed within the channel, and can include a sealing mechanism disposed between the cover and the module.Type: ApplicationFiled: May 1, 2018Publication date: November 7, 2019Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jerome TEYSSEYRE, Roveendra PAUL, Dukyong LEE
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Publication number: 20180315681Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.Type: ApplicationFiled: September 25, 2017Publication date: November 1, 2018Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Seungwon IM, Oseob JEON, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE, Changyoung PARK