Patents by Inventor Durodami Joscelyn Lisk

Durodami Joscelyn Lisk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless interconnects in an interposer
    Patent number: 9165791
    Abstract: Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: October 20, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Xiaoxia Wu, Yunqiang Yang, Chengjie Zuo, Durodami Joscelyn Lisk
  • WIRELESS INTERCONNECTS IN AN INTERPOSER
    Publication number: 20150115405
    Abstract: Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Xiaoxia Wu, Yunqiang Yang, Chengjie Zuo, Durodami Joscelyn Lisk
  • VIA-ENABLED PACKAGE-ON-PACKAGE
    Publication number: 20140252561
    Abstract: A via-enabled package-on-package circuit includes a first package including a first package die having a plurality of through substrate vias (TSVs). The TSVs are configured to carry the input/output signaling for at least one second package die.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 11, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Durodami Joscelyn Lisk, Vidhya Ramachandran, Jae Sik Lee
  • DUAL SUBSTRATE, POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT STACKED INTEGRATED DEVICES
    Publication number: 20140225246
    Abstract: Some implementations provide an integrated device that includes a first substrate, a first die coupled to the first substrate, a second die coupled to the first die, and a second substrate coupled to the second die. The second substrate is configured to provide an electrical path for a signal to the second die. The integrated device further includes a molding surrounding the first die and the second die, and several through mold vias (TMVs) coupled to the second substrate. The TMVs are configured to provide an electrical path for the signal to the second die through the second substrate. In some implementations, the second substrate includes a signal distribution structure configured to provide the electrical path for the signal to the second die. In some implementations, the first substrate and the second substrate are part of a signal distribution network that provides signal to the second die.
    Type: Application
    Filed: December 18, 2013
    Publication date: August 14, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Brian Matthew Henderson, Durodami Joscelyn Lisk, Shiqun Gu, Ratibor Radojcic, Matthew Michael Nowak