Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

Abstract: The disclosure describes a probe card assembly for nondestructive integrated circuit testing. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof.

Abstract: Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.

Abstract: A probe conducts testing of a circuit. The probe includes a base coupled to a substrate. The probe also includes a cantilever attached to the base at a first end, the cantilever deflecting from a first position to a second position in which a second end opposite the first end is in contact with the substrate and to move between the second position and the first position based on movement of a compliant bump of the circuit, and a probe tip attached to the cantilever at the second end, the probe tip maintaining contact with the compliant bump of the circuit.

Abstract: A method of probing compliant bumps of a circuit with probes is described. The method includes disposing the probes on a substrate, a base of each of the probes being coupled to the substrate. The method also includes disposing the circuit such that each of the compliant bumps is in contact with the probe tip of a corresponding one of the probes, each probe tip being connected to each base of each probe through a cantilever, and supplying current to the probes to test the circuit.

Abstract: A method of probing compliant bumps of a circuit with probes is described. The method includes disposing the probes on a substrate, a base of each of the probes being coupled to the substrate. The method also includes disposing the circuit such that each of the compliant bumps is in contact with the probe tip of a corresponding one of the probes, each probe tip being connected to each base of each probe through a cantilever, and supplying current to the probes to test the circuit.

Abstract: A probe conducts testing of a circuit. The probe includes a base coupled to a substrate. The probe also includes a cantilever attached to the base at a first end, the cantilever deflecting from a first position to a second position in which a second end opposite the first end is in contact with the substrate and to move between the second position and the first position based on movement of a compliant bump of the circuit, and a probe tip attached to the cantilever at the second end, the probe tip maintaining contact with the compliant bump of the circuit.

Abstract: Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.

Abstract: Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.

Abstract: Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.