Patents by Inventor Dustin W. Demetriou
Dustin W. Demetriou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10160072Abstract: A method of fabricating a liquid-cooled heat sink assembly, including: providing a heat transfer element including a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to a component(s) to be cooled; providing a coolant-carrying structure including a coolant-carrying base and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base including a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat sink base to extend through; and attaching the heat transfer element and coolant-carrying structure together with the plurality of thermally conductive fins extending through the fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.Type: GrantFiled: October 26, 2015Date of Patent: December 25, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dylan J. Boday, Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons, Prabjit Singh, Jason T. Wertz
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Patent number: 10152394Abstract: A system, method and computer program product for optimizing total cost of ownership (TCO) of a piece of IT equipment, e.g., a hard drive or server, using predictive analytics. The data center environment monitors and measures a number of environment variables, including temperature, Relative Humidity, and corrosion. For each piece of hardware, several pieces of data are assigned, including a criticality measure, an operational cost (function of environment), a static replacement cost, and a downtime cost (function of time). For each piece of hardware, if it has not yet failed, the system predicts a time-to-failure using the environment variables. If predicted time-to-failure exceeds an expected reference life criteria, real time TCO analytics is performed to minimize data center energy usage and/or maximize operational cost-efficiency.Type: GrantFiled: September 27, 2016Date of Patent: December 11, 2018Assignee: International Business Machines CorporationInventors: Dustin W. Demetriou, Vidhya Shankar Venkatesan
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Publication number: 20180328236Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.Type: ApplicationFiled: July 24, 2018Publication date: November 15, 2018Inventors: Levi A. CAMPBELL, Milnes P. DAVID, Dustin W. DEMETRIOU, Roger R. SCHMIDT, Robert E. SIMONS
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Patent number: 10082048Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.Type: GrantFiled: August 29, 2016Date of Patent: September 25, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons
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Patent number: 10070560Abstract: Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).Type: GrantFiled: June 7, 2016Date of Patent: September 4, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons
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Patent number: 9996092Abstract: Aspects include a method, system, and computer program product for determining a time to a threshold temperature of a device in a data center. A method includes measuring parameters for a device and the data center. A rate of change of temperature is determined based on the parameters. The change is compared to a change threshold. It is determined that a cooling system is operating below a threshold when the change is above the threshold. A first time is determined based on the rate of change of temperature and a machine learning model. The first and second time are compared, where the second time is a time to restore the cooling system above the threshold. A signal is transmitted when the first time is less than the second time. A cooling capacity is determined to have the temperature change of the device be equal to or less than the threshold.Type: GrantFiled: January 9, 2017Date of Patent: June 12, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dustin W. Demetriou, Roger R. Schmidt, Vidhya Shankar Venkatesan
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Patent number: 9968006Abstract: Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction.Type: GrantFiled: August 20, 2015Date of Patent: May 8, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, Robert K. Mullady, Roger R. Schmidt
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Publication number: 20180107848Abstract: Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.Type: ApplicationFiled: December 11, 2017Publication date: April 19, 2018Inventors: Levi A. CAMPBELL, Milnes P. DAVID, Dustin W. DEMETRIOU, Michael J. ELLSWORTH, JR.
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Patent number: 9949412Abstract: A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.Type: GrantFiled: October 26, 2015Date of Patent: April 17, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons
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Publication number: 20180098463Abstract: Apparatuses and methods are provided for blocking removal of an air-moving assembly from a housing when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the housing, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.Type: ApplicationFiled: November 22, 2017Publication date: April 5, 2018Inventors: Levi A. Campbell, Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, Robert K. Mullady, Roger R. Schmidt
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Publication number: 20180089042Abstract: A system, method and computer program product for optimizing total cost of ownership (TCO) of a piece of IT equipment, e.g., a hard drive or server, using predictive analytics. The data center environment monitors and measures a number of environment variables, including temperature, Relative Humidity, and corrosion. For each piece of hardware, several pieces of data are assigned, including a criticality measure, an operational cost (function of environment), a static replacement cost, and a downtime cost (function of time). For each piece of hardware, if it has not yet failed, the system predicts a time-to-failure using the environment variables. If predicted time-to-failure exceeds an expected reference life criteria, real time TCO analytics is performed to minimize data center energy usage and/or maximize operational cost-efficiency.Type: ApplicationFiled: September 27, 2016Publication date: March 29, 2018Inventors: Dustin W. Demetriou, Vidhya Shankar Venkatesan
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Publication number: 20180082926Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.Type: ApplicationFiled: November 30, 2017Publication date: March 22, 2018Inventors: Levi A. CAMPBELL, Milnes P. DAVID, Dustin W. DEMETRIOU, Michael J. ELLSWORTH, JR., Roger R. SCHMIDT, Robert E. SIMONS
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Publication number: 20180077824Abstract: A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.Type: ApplicationFiled: November 21, 2017Publication date: March 15, 2018Inventors: Levi A. CAMPBELL, Michael J. ELLSWORTH, JR., Milnes P. DAVID, Dustin W. DEMETRIOU, Roger R. SCHMIDT, Robert E. SIMONS
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Patent number: 9907211Abstract: Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction.Type: GrantFiled: September 29, 2014Date of Patent: February 27, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, Robert K. Mullady, Roger R. Schmidt
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Patent number: 9904811Abstract: Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.Type: GrantFiled: April 27, 2016Date of Patent: February 27, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr.
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Patent number: 9865522Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.Type: GrantFiled: November 18, 2014Date of Patent: January 9, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons
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Patent number: 9861010Abstract: Apparatuses and methods are provided for blocking removal of an air-moving assembly from a chassis when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the chassis, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.Type: GrantFiled: September 29, 2014Date of Patent: January 2, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Christopher R. Ciraulo, Milnes P. David, Dustin W. Demetriou, Robert K. Mullady, Roger R. Schmidt
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Publication number: 20170316228Abstract: Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.Type: ApplicationFiled: April 27, 2016Publication date: November 2, 2017Inventors: Levi A. CAMPBELL, Milnes P. DAVID, Dustin W. DEMETRIOU, Michael J. ELLSWORTH, JR.
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Publication number: 20170303429Abstract: Electronics cooling assemblies are provided which include an air-cooled heat sink, an auxiliary air-moving device, and an airflow-blocking mechanism. The heat sink couples to one or more heat-generating electronic components, and dissipates heat from the electronic component(s) to a cooling airflow passing across the heat sink. The auxiliary air-moving device provides, when active, an increased flow rate of the cooling airflow across the heat sink. The airflow-blocking mechanism toggles between a passive airflow position and an active airflow position. In the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the heat sink without passing through the air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.Type: ApplicationFiled: April 18, 2016Publication date: October 19, 2017Inventors: Levi A. CAMPBELL, Milnes P. DAVID, Dustin W. DEMETRIOU, Michael J. ELLSWORTH, JR.
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Patent number: 9795055Abstract: Electronics cooling assemblies are provided which include an air-cooled heat sink, an auxiliary air-moving device, and an airflow-blocking mechanism. The heat sink couples to one or more heat-generating electronic components, and dissipates heat from the electronic component(s) to a cooling airflow passing across the heat sink. The auxiliary air-moving device provides, when active, an increased flow rate of the cooling airflow across the heat sink. The airflow-blocking mechanism toggles between a passive airflow position and an active airflow position. In the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the heat sink without passing through the air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.Type: GrantFiled: April 18, 2016Date of Patent: October 17, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr.