Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and increase the bandwidth of the interconnects, respectively. According to this invention, the interconnection system has also lower effective dielectric constant, which would help to reduce the signal propagation delay and reduce the signal skews. The interconnect systems consists of the signal line, inhomogeneous dielectric system consisting of the homogeneous dielectric layer and conducting or metal plans having 1-diemensioanl or 2-dimensioanl arrays in structure, located into the homogeneous dielectric layer, and the ground plan. The signal line proposed in this invention could be any type of signal line configuration for example, microstripline, strip line or coplanar line.

Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and increase the bandwidth of the interconnects and also reduce the signal propagation delay, respectively. Ideally, the speed of the electrical signal on the signal line can be reached to speed of the light in the air, and the bandwidth can be reached to closer to the optical fiber. The interconnect systems consists of the signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, and the ground plan. The signal line proposed in this invention could be made any type of signal line configuration for example, microstripline, strip line or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations.