Abstract: The invention relates to a process for identifying patients affected by an autoimmune neurological disease, comprising a step of detection of at least one type of anti-Argonaute autoantibodies (AGO-Abs) in a biological sample of an individual susceptible to be affected by said disease, wherein positive detection of said at least one type of AGO-Abs means that said individual is affected by said autoimmune neurological disease.

Abstract: The invention relates to a process in vitro for diagnosing a paraneoplastic neurological syndrome (PNS) associated with a tumor in an individual, comprising the detection of at least one antibody chosen among antibodies against TRIM9 and antibodies against TRIM67, in a biological fluid of said individual.

Abstract: Sensor packages and methods of assembling sensor packages are provided. A preferred embodiment comprises: a ceramic base comprised of a platform and walls that extend up from the platform around the periphery of the platform to form a cavity; a sensor mounted to the ceramic base; a circuit board mounted down into the cavity wherein the circuit board has a hole through the board that aligns with the sensor such that the sensor is exposed to a top side of the circuit board through the hole; a plurality of electrical connections between the sensor and the circuit board; a plurality of electrical pins mounted to the circuit board and extending up above the walls of the ceramic base; and a cap mounted down into the cavity over the top of the circuit board, the cap including a window that allows the electrical pins to pass through the cap.

Abstract: A sensor assembly is provided that allows for a more rapid sensing of thermal changes. In preferred embodiments, the sensor assembly includes a housing, sensor package, bushing, coupling and gasket. The bushing is made from a conductive material like copper or silver and provides a conductive path from the bottom of the sensor package directly into the medium whose temperature is to be sensed or close thereto. A coupling is provided between the conductive bushing the metal housing to prevent heat exchange between the metal housing and the bushing. The gasket is placed in compression and provides a constant force holding the conductive bushing against the bottom of the sensor package.

Abstract: Sensor packages and methods of assembling a sensor in a sensor package are provided. A preferred embodiment comprises: a base including a sensor coupled to the base wherein the base has at least one electrical connection location and a first mechanical mating interface in the shape of an arc; an electronics package with at least one electrical connection location; and a ring coupled between the base and the electronics package wherein the ring electrically connects the at least one electrical connection location on the base and the at least one electrical connection location on the electronics package and wherein the base has a second mechanical mating interface in the shape of an arc that is reciprocal to the first mating interface.

Abstract: A sensor assembly is provided that allows for a more rapid sensing of thermal changes. In preferred embodiments, the sensor assembly includes a housing, sensor package, bushing, coupling and gasket. The bushing is made from a conductive material like copper or silver and provides a conductive path from the bottom of the sensor package directly into the medium whose temperature is to be sensed or close thereto. A coupling is provided between the conductive bushing the metal housing to prevent heat exchange between the metal housing and the bushing. The gasket is placed in compression and provides a constant force holding the conductive bushing against the bottom of the sensor package.

Abstract: Sensor packages and methods of assembling a sensor in a sensor package are provided. A preferred embodiment comprises: a base including a sensor coupled to the base wherein the base has at least one electrical connection location and a first mechanical mating interface in the shape of an arc; an electronics package with at least one electrical connection location; and a ring coupled between the base and the electronics package wherein the ring electrically connects the at least one electrical connection location on the base and the at least one electrical connection location on the electronics package and wherein the base has a second mechanical mating interface in the shape of an arc that is reciprocal to the first mating interface.

Abstract: A multiple access wireless communications architecture provides selective, simultaneous communications with wireless devices located in different sections of a spatial area around a communications apparatus referred to as “sectors”. In one embodiment, channel allocation techniques for increasing one or more of throughput and coverage in a wireless communications environment.