Patents by Inventor Dwayne L. LaBrake
Dwayne L. LaBrake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10859913Abstract: A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. A body of a superstrate can have bending characteristics that are well suited to achieve both conformal and planarization behavior. The body can have a surface and a thickness in a range of t1 to t2, t1=(Pd4/2Eh)1/3; t2=(5Pd4/2Eh)1/3; P is a pressure corresponding to a capillary force between the body and a planarization precursor material; d is a bending distance; E is Young's modulus for the body; and h is a step height difference between two adjacent regions of a substrate. In an embodiment, a thickness can be selected and used to determine the maximum out-of-plane displacement, wmax, for conformal behavior is sufficient and that wmax for planarization behavior is below a predetermined threshold.Type: GrantFiled: January 8, 2020Date of Patent: December 8, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Dwayne L. LaBrake, Niyaz Khusnatdinov
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Publication number: 20200142300Abstract: A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. A body of a superstrate can have bending characteristics that are well suited to achieve both conformal and planarization behavior. The body can have a surface and a thickness in a range of t1 to t2, t1=(Pd4/2Eh)1/3; t2=(5Pd4/2Eh)1/3; P is a pressure corresponding to a capillary force between the body and a planarization precursor material; d is a bending distance; E is Young's modulus for the body; and h is a step height difference between two adjacent regions of a substrate. In an embodiment, a thickness can be selected and used to determine the maximum out-of-plane displacement, wmax, for conformal behavior is sufficient and that wmax for planarization behavior is below a predetermined threshold.Type: ApplicationFiled: January 8, 2020Publication date: May 7, 2020Inventors: Dwayne L. LaBrake, Niyaz Khusnatdinov
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Patent number: 10606171Abstract: A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. A body of a superstrate can have bending characteristics that are well suited to achieve both conformal and planarization behavior. The body can have a surface and a thickness in a range of t1 to t2, t1=(Pd4/2Eh)1/3; t2=(5Pd4/2Eh)1/3; P is a pressure corresponding to a capillary force between the body and a planarization precursor material; d is a bending distance; E is Young's modulus for the body; and h is a step height difference between two adjacent regions of a substrate. In an embodiment, a thickness can be selected and used to determine the maximum out-of-plane displacement, wmax, for conformal behavior is sufficient and that wmax for planarization behavior is below a predetermined threshold.Type: GrantFiled: February 14, 2018Date of Patent: March 31, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Dwayne L. LaBrake, Niyaz Khusnatdinov
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Patent number: 10580659Abstract: Methods and apparatus for planarization of a substrate. Material is dispensed onto the substrate that varies depending upon the substrate topography variation. A superstrate is brought into contact with the material, the material takes on a shape of the superstrate. The material is solidified. The superstrate is lifted away from the solidified material. Material has a first shrinkage coefficient. Second material is dispensed onto the solidified material with an average thickness. The average thickness is greater than a second material thickness threshold that is dependent upon step height of the substrate and the first shrinkage coefficient. The second material is then solidified.Type: GrantFiled: July 30, 2018Date of Patent: March 3, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Niyaz Khusnatdinov, Douglas J. Resnick, Dwayne L. LaBrake
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Publication number: 20190250505Abstract: A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. A body of a superstrate can have bending characteristics that are well suited to achieve both conformal and planarization behavior. The body can have a surface and a thickness in a range of t1 to t2, t1=(Pd4/2Eh)1/3; t2=(5Pd4/2Eh)1/3; P is a pressure corresponding to a capillary force between the body and a planarization precursor material; d is a bending distance; E is Young's modulus for the body; and h is a step height difference between two adjacent regions of a substrate. In an embodiment, a thickness can be selected and used to determine the maximum out-of-plane displacement, wmax, for conformal behavior is sufficient and that wmax for planarization behavior is below a predetermined threshold.Type: ApplicationFiled: February 14, 2018Publication date: August 15, 2019Inventors: Dwayne L. LaBrake, Niyaz Khusnatdinov
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Patent number: 10304690Abstract: A method of can be used to generating a fluid droplet pattern for an imprint lithography process. A fluid dispense head can include a set of fluid dispense ports, wherein the fluid dispense ports are in a fixed arrangement. The method can include rotating the set of the fluid dispense ports to a rotation angle to change a fluid droplet pitch in a first direction; moving a substrate and the set of the fluid dispense ports relative to each other in a second direction substantially perpendicular to the first direction; and dispensing fluid droplets onto the substrate while moving the substrate and the set of the fluid dispense ports relative to each other. The method can be used in the formation of an electronic component within or over a semiconductor substrate. The apparatus can be configured to carry out the methods as described herein.Type: GrantFiled: March 22, 2017Date of Patent: May 28, 2019Assignee: CANON KABUSHIKI KAISHAInventors: Niyaz Khusnatdinov, Dwayne L. LaBrake
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Publication number: 20190080922Abstract: Methods and apparatus for planarization of a substrate. Material is dispensed onto the substrate that varies depending upon the substrate topography variation. A superstrate is brought into contact with the material, the material takes on a shape of the superstrate. The material is solidified. The superstrate is lifted away from the solidified material. Material has a first shrinkage coefficient. Second material is dispensed onto the solidified material with an average thickness. The average thickness is greater than a second material thickness threshold that is dependent upon step height of the substrate and the first shrinkage coefficient. The second material is then solidified.Type: ApplicationFiled: July 30, 2018Publication date: March 14, 2019Inventors: Niyaz Khusnatdinov, Douglas J. Resnick, Dwayne L. LaBrake
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Patent number: 10211051Abstract: Methods of reversing the tone of a pattern having non-uniformly sized features. The methods include depositing a highly conformal hard mask layer over the patterned layer with a non-planar protective coating and etch schemes for minimizing critical dimension variations.Type: GrantFiled: October 28, 2016Date of Patent: February 19, 2019Assignee: CANON KABUSHIKI KAISHAInventors: Niyaz Khusnatdinov, Dwayne L. LaBrake
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Publication number: 20180277383Abstract: A method of can be used to generating a fluid droplet pattern for an imprint lithography process. A fluid dispense head can include a set of fluid dispense ports, wherein the fluid dispense ports are in a fixed arrangement. The method can include rotating the set of the fluid dispense ports to a rotation angle to change a fluid droplet pitch in a first direction; moving a substrate and the set of the fluid dispense ports relative to each other in a second direction substantially perpendicular to the first direction; and dispensing fluid droplets onto the substrate while moving the substrate and the set of the fluid dispense ports relative to each other. The method can be used in the formation of an electronic component within or over a semiconductor substrate. The apparatus can be configured to carry out the methods as described herein.Type: ApplicationFiled: March 22, 2017Publication date: September 27, 2018Inventors: Niyaz Khusnatdinov, Dwayne L. LaBrake
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Patent number: 10079152Abstract: A method used to create small pattern features over existing topography variations. The method includes providing a substrate having a surface having non-planar surface variations; forming a multi-stack layer over the substrate, by applying a first carbon layer over the substrate, with the resultant first carbon layer having non-planar surface variations corresponding to the non-planar surface variations of the underlying substrate, followed by applying a second planarizing layer over the first carbon layer; depositing a hard mask on the multi-stack layer; forming a patterned layer on the hard mask, the formed patterned layers having features; and performing one or more etch steps to etch the formed patterned layer features into the multi-layer stack. The multi-layer stack has a composite effective mechanical stiffness (Eeff) sufficient to maintain the one or more etched features with minimal feature collapse.Type: GrantFiled: February 24, 2017Date of Patent: September 18, 2018Assignee: CANON KABUSHIKI KAISHAInventors: Dwayne L. LaBrake, Douglas J. Resnick
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Publication number: 20180247823Abstract: A method used to create small pattern features over existing topography variations. The method includes providing a substrate having a surface having non-planar surface variations; forming a multi-stack layer over the substrate, by applying a first carbon layer over the substrate, with the resultant first carbon layer having non-planar surface variations corresponding to the non-planar surface variations of the underlying substrate, followed by applying a second planarizing layer over the first carbon layer; depositing a hard mask on the multi-stack layer; forming a patterned layer on the hard mask, the formed patterned layers having features; and performing one or more etch steps to etch the formed patterned layer features into the multi-layer stack. The multi-layer stack has a composite effective mechanical stiffness (Eeff) sufficient to maintain the one or more etched features with minimal feature collapse.Type: ApplicationFiled: February 24, 2017Publication date: August 30, 2018Inventors: Dwayne L. LaBrake, Douglas J. Resnick
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Publication number: 20170140921Abstract: Methods of reversing the tone of a pattern having non-uniformly sized features. The methods include depositing a highly conformal hard mask layer over the patterned layer with a non-planar protective coating and etch schemes for minimizing critical dimension variations.Type: ApplicationFiled: October 28, 2016Publication date: May 18, 2017Inventors: Niyaz Khusnatdinov, Dwayne L. LaBrake
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Patent number: 9514950Abstract: Methods of increasing etch selectivity in imprint lithography are described which employ material deposition techniques that impart a unique morphology to the multi-layer material stacks, thereby enhancing etch process window and improving etch selectivity. For example, etch selectivity of 50:1 or more between patterned resist layer and deposited metals, metalloids, or non-organic oxides can be achieved, which greatly preserves the pattern feature height prior to the etch process that transfers the pattern into the substrate, allowing for sub-20 nm pattern transfer at high fidelity.Type: GrantFiled: December 30, 2014Date of Patent: December 6, 2016Assignees: Canon Nanotechnologies, Inc., Molecular Imprints, Inc.Inventors: Zhengmao Ye, Dwayne L. LaBrake
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Publication number: 20150187590Abstract: Methods of increasing etch selectivity in imprint lithography are described which employ material deposition techniques that impart a unique morphology to the multi-layer material stacks, thereby enhancing etch process window and improving etch selectivity. For example, etch selectivity of 50:1 or more between patterned resist layer and deposited metals, metalloids, or non-organic oxides can be achieved, which greatly preserves the pattern feature height prior to the etch process that transfers the pattern into the substrate, allowing for sub-20 nm pattern transfer at high fidelity.Type: ApplicationFiled: December 30, 2014Publication date: July 2, 2015Inventors: Zhengmao Ye, Dwayne L. LaBrake
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Publication number: 20150165655Abstract: Imprint lithography templates having alignment marks with highly absorptive material. The alignment marks are insensitive to the effects of liquid spreading and can provide stability and increase contrast to alignment system during liquid imprint filling of template features.Type: ApplicationFiled: February 27, 2015Publication date: June 18, 2015Inventors: Niyaz Khusnatdinov, Kosta S. Selinidis, Jospeh Michael Imhof, Dwayne L. LaBrake
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Patent number: 8967992Abstract: Imprint lithography templates having alignment marks with highly absorptive material. The alignment marks are insensitive to the effects of liquid spreading and can provide stability and increase contrast to alignment system during liquid imprint filling of template features.Type: GrantFiled: April 25, 2012Date of Patent: March 3, 2015Assignees: Canon Nanotechnologies, Inc., Molecular Imprints, Inc.Inventors: Niyaz Khusnatdinov, Kosta S. Selinidis, Joseph Michael Imhof, Dwayne L. LaBrake
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Patent number: 8935981Abstract: Two-stage imprinting techniques capable of protecting fine patterned features of an imprint lithography template are herein described. In particular, such techniques may be used during fabrication of recessed high-contrast alignment marks for preventing deposited metal layers from coming into contact with fine features etched into the template.Type: GrantFiled: September 26, 2011Date of Patent: January 20, 2015Assignee: Canon Nanotechnologies, Inc.Inventors: Joseph Michael Imhof, Kosta S. Selinidis, Dwayne L. LaBrake
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Patent number: 8891080Abstract: Detection of periodically repeating nanovoids is indicative of levels of substrate contamination and may aid in reduction of contaminants on substrates. Systems and methods for detecting nanovoids, in addition to, systems and methods for cleaning and/or maintaining cleanliness of substrates are described.Type: GrantFiled: July 7, 2011Date of Patent: November 18, 2014Assignees: Canon Nanotechnologies, Inc., Molecular Imprints, Inc.Inventors: Niyaz Khusnatdinov, Dwayne L. LaBrake
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Patent number: 8641958Abstract: Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.Type: GrantFiled: January 17, 2013Date of Patent: February 4, 2014Assignee: Molecular Imprints, Inc.Inventors: Niyaz Khusnatdinov, Christopher Ellis Jones, Joseph G. Perez, Dwayne L. LaBrake, Ian Matthew McMackin
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Publication number: 20140021167Abstract: Methods for creating nano-shaped patterns are described. This approach may be used to directly pattern substrates and/or create imprint lithography molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates in a high throughput process.Type: ApplicationFiled: September 9, 2013Publication date: January 23, 2014Applicants: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM, MOLECULAR IMPRINTS, INC.Inventors: Sidlgata V. Sreenivasan, Shuqiang Yang, Frank Y. Xu, Dwayne L. LaBrake