Abstract: Methods, circuits, and disk drive that correct errors in data that is temporarily stored in a memory buffer are disclosed. An error detection code and an error correction code are generated for data. The data, the error detection code, and the error correction code are stored in the memory buffer. The data is retrieved from the memory buffer and error detected using the error detection code. In response to detecting an error, the error correction code is applied to the retrieved data to generate corrected data.

Abstract: A memory system is provided which can adapt to being coupled to a bus capable of running at different clock speeds. The memory system is responsive to signals provided by a bus speed sensor for modifying the timing of row address strobe (RAS), column address strobe (CAS) and write enable (WE) signals. By modifying the timing of the RAS, CAS, and WE signals, the memory can be operated in systems capable of operating at a variety of bus speeds without suffering latency problems normally associated with changes in bus speed.

Abstract: Conflicting users of a shared resource are controlled by respective state machines having cross-coupled busy signals permitting each user to proceed with exclusive use of the shared resource when the other users are finished using the resource. Priority logic responsive to service requests issues grant signals to the state machines so that the state machines do not permit their respective users to begin simultaneously exclusive use of the resource. Preferably, each state machine also receives the requests for service of its respective user. Each state machine, for example, has an idle state, a first state reached from the idle state in response to a service request; a second state reached from the first state in response to a grant signal; and a third state reached from the second state, unless the busy signal of another state machine is asserted. Preferably, each state machine is responsive to a request having different preassigned priorities.

Abstract: A low-profile, high-density package for intergrated circuit chips is provided. A first multichip memory module includes first and second interconnect members having low-profile memory chips mounted on a first side of each member. Low-profile edge clips are employed to mechanically connect a second side of the second member to a second side of the first member, and to electrically connect the first sides of the members to a first surface of a circuit board. Likewise, a second multichip memory module includes first and second interconnect members having low-profile memory chips mounted to a first side of each member. Low-profile edge clips are employed to mechanically connect the second sides of the members, and to electrically connect the first sides of the members to a second surface of the circuit board. A thermal management technique that distributes thermal loads is thereafter applied to create a high-density package capable of insertion into a standard computer backplane and cabinet.

Abstract: A high-density memory module has thirty-two memory integrated circuit chips, sixteen decoupling capacitors, and two resistors mounted on a double-sided multi-layer printed wiring board having a series of edge terminals for connection to a motherboard. One side of the board has a first 2.times.8 rectangular matrix of the chips, and the other side of the board has a second 2.times.8 matrix of the chips. The chips are grouped into four "strings," each of which includes eight chips which receive the same row address strobe and column address strobe. Each string is selected by a unique row address strobe. All four strings share a common data bus. Two of the strings share a first column address strobe and a first address bus, and the other two strings share a second column address strobe and a second address bus, to facilitate four-way interleaved memory access.