Abstract: The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.

Abstract: A semiconductor device has a substrate and a first electrical component including a sensing region disposed over the substrate. The sensing region can be responsive to external stimuli, such as pressure. A cover lid is disposed over the first electrical component and extending to the substrate with an opening in the cover lid aligned over the sensing region. A gel material is disposed within the opening of the cover lid to seal the sensing region with respect to an environment condition, such as liquid. A bond wire is coupled between the first electrical component and substrate. An adhesive layer is disposed around a perimeter of the sensing area and the cover lid is bonded to the adhesive layer. A second electrical component is disposed on the substrate and the first electrical component is disposed on the second electrical component.

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.

Abstract: The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.