Abstract: A method for closing housing having first and second heat conductive housing elements, involves arranging a joining material between the housing elements. At least one of the housing elements is heated such that the joining material is conditioned for the joining of the housing elements. At least one of the housing elements has a localized reduction in the heat conductivity such that the dissipation of heat in the at least one housing element is reduced.

Abstract: A housing includes first and second housing elements, each of which is heat conductive. The housing elements are joined by a joining process in which a joining material is configured between the first and second housing elements and at least one of the housing elements is heated such that the joining material is conditioned for the joining of the housing elements. At least one of the housing elements has a localized reduction in the heat conductivity such that the dissipation of heat in the at least one housing element is reduced.

Abstract: The optoelectronic receiver includes a device (12) for taking in or collecting optical signals, an optical sensor (16) for converting the optical signals into electronic signals; a coupling element (26) for alignment of the optic axis of the device for taking in or collecting the optical signals on a sensitive surface of the optical sensor, a holder (42) for the device (12) for taking in the optical signals; a retaining device (24) for the coupling element (26); and a joint adjusting means (28) for adjusting the holder (42) for the device for taking in the optical signals and the retaining device (24) for the coupling element. After adjustment using the joint adjusting means the holder and retaining device are fixed in position to form an aligned optoelectronic receiver. A method of making the aligned optoelectronic receiver is also described.

Abstract: The arrangement focuses a combined laser beam (33) composed of individual laser beams produced by laser diodes (2) on a common spot. Prismatic reflecting bodies (7,8) are arranged in depressions (11,12) provided in a common substrate (1) between parallel rows (R1,R2; R3,R4) of the laser diodes (2). Each reflecting body (7,8) has oppositely inclined reflecting surfaces arranged on opposite sides thereof for deflection of the individual laser beams from the two adjacent rows of laser diodes. Two cylindrical lenses (9) are arranged on opposite sides of each reflecting body (7,8) between the laser diodes and the reflective surfaces to convert elliptical remote fields of the laser beams into circularly symmetric remote fields. Laterally movable focusing lenses (14) for each individual laser beam are arranged on the reflecting bodies (7,8) between the common spot and the reflecting surfaces for individual adjustment of the laser beams, whereby the combined laser beam (33) is focussed on the common spot.

Abstract: The invention is directed to a high-frequency semiconductor laser module with a silicon substrate, especially made of low-impedance silicon, a laser diode arranged thereon, and at least two lines for the H-F feed, one of which is insulated from the silicon substrate by a dielectric layer. According to the invention, the laser diode is arranged on the silicon substrate via a metallic mounting layer, and the H-F line is guided close to the laser diode on the dielectric layer.

Abstract: The arrangement for producing electrical oscillations in a Giga hertz region has a Gunn element, a housing in which the Gunn element is accommodated and which has an electrically conductive housing cover, the Gunn element being in electrical contact with the electrically conductive housing cover, and an elastic, electrical contact element clamped between a contact surface of the Gunn element and the housing cover.

Abstract: The device for generating an electrical control according to a position of a light beam in relation to a separating line includes two photodetectors (14,24), one (14) of which is arranged for detecting light falling on one side of the separating line and another (24) of which is arranged for detecting light falling on another side of the separating line. The separating line is an edge (30) extending between two (1,1,1) crystallographic planes of a crystalline substrate and the (1,1,1) crystallographic planes reflect respective parts of the light beam to the respective photodetectors.

Abstract: A housing for an electronic component has a bottom part, a wall part, a cover part which together are adapted to cover the electronic component, a contact spring provided on the cover part for producing an electrical connection with a terminal of the component, the cover part and the contact spring being formed as a one-piece integral element.

Abstract: The circuit board (1) has a component (101) mounted on it by means of a soldering process which causes an automatic, passive alignment of the component (101) due to the surface tension in a melted piece of solder which electrically connects two pads (2, 102), one (102) of which is on the component and the other (2) of which is on the circuit board. Stand-offs (20) are used to provide a suitable spacing or distance between the component (101) and the circuit board (1). The other pad (2) has a surface that is divided into a central part (3) and an edge part (4), both wettable by the solder. The second or edge part (4) is shaped like a ring and surrounds the central part and is composed so that it is more slowly wettable by the solder than the central part. The spacing established by the stand-offs is dimensioned so that a melted piece of the solder between the pads produces a force drawing the component (101) toward the circuit board (1) because of surface tension in the melted solder.

Abstract: The laser module couples its semiconductor laser to an optical device, e.g. an optical fiber, particularly a monomode fiber. The laser module includes a micromechanically structured silicon substrate (31) provided with an elongated groove (30) having a longitudinal axis by an anisotropic etching technique; a semiconductor laser (110) mounted on the silicon substrate (31) to emit light parallel to the longitudinal axis of the elongated groove; an optical coupling device including an isolator (10) positioned on the silicon substrate (31) so that light from the semiconductor laser (110) passes therethrough and a sealed housing (50) inside of which the silicon subtrate (31), the semiconductor laser (110) and the isolator are contained.