Abstract: Memory devices may have an array of elements in two or more dimensions. The memory devices use multiple access lines arranged in a grid to access the memory devices. Memory cells located at intersections of the access lines in the grid. Drivers are used for each access line and configured to transmit a corresponding signal to respective memory cells of the plurality of memory cells via a corresponding access line. The memory devices may use an address scrambler to determine a bit error rate for accessing memory cells and remap an address of a particular memory cell to have a bit error rate below a threshold. In this way, the address scrambler may distribute the bit error rates of multiple accesses of the array.

Abstract: Memory devices may have an array of elements in two or more dimensions. The memory devices use multiple access lines arranged in a grid to access the memory devices. Memory cells located at intersections of the access lines in the grid. Drivers are used for each access line and configured to transmit a corresponding signal to respective memory cells of the plurality of memory cells via a corresponding access line. The memory devices may use an address scrambler to determine a bit error rate for accessing memory cells and remap an address of a particular memory cell to have a bit error rate below a threshold. In this way, the address scrambler may distribute the bit error rates of multiple accesses of the array.

Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.

Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.

Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.

Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.

Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.

Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.

Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.

Abstract: Signal transmission apparatus, systems, and methods are disclosed. In various embodiments, a signal transmission system includes a transmission network having signal paths configured to communicate signals from an input to an output, a first steering network coupled to the input that communicates with the transmission network, and a second steering network coupled to the output that communicates with the transmission network. A steering control network that receives error signals corresponding to an inoperable signal path and that generates steering signals directed to the first steering network and the second steering network is included, so that the steering signals shift signals to an alternate, operable signal path from the inoperable signal path. Additional apparatus, systems, and methods are disclosed.

Abstract: Various embodiments include apparatus and methods having circuitry to test continuity of conductive paths coupled to dice arranged in a stack. In at least one of these embodiments, a method includes electrically coupling each of the conductive paths to at least one of a first supply node and a second supply node. One of the conductive paths includes conductive material inside a via that can extend at least partly through a die among the dice in the stack. The method also includes receiving signals from the conductive paths, and determining continuity of the conductive paths based on the signals without using a boundary scan.

Abstract: Signal transmission apparatus, systems, and methods are disclosed. In various embodiments, a signal transmission system includes a transmission network having signal paths configured to communicate signals from an input to an output, a first steering network coupled to the input that communicates with the transmission network, and a second steering network coupled to the output that communicates with the transmission network. A steering control network that receives error signals corresponding to an inoperable signal path and that generates steering signals directed to the first steering network and the second steering network is included, so that the steering signals shift signals to an alternate, operable signal path from the inoperable signal path. Additional apparatus, systems, and methods are disclosed.

Abstract: Data digits and correction digits are received in each of a number of integrated circuit (IC) devices. Apparatus, systems, and methods are disclosed that operate to check the data digits for error in each IC device according to an algorithm associated with the IC device, the algorithm being different for each IC device. Each IC device will act in response to the data digits if no error is detected in the data digits. Additional apparatus, systems, and methods are disclosed.

Abstract: Data digits and correction digits are received in each of a number of integrated circuit (IC) devices. Apparatus, systems, and methods are disclosed that operate to check the data digits for error in each IC device according to an algorithm associated with the IC device, the algorithm being different for each IC device. Each IC device will act in response to the data digits if no error is detected in the data digits. Additional apparatus, systems, and methods are disclosed.

Abstract: In one aspect of the invention, a method of reducing intersymbol interference on a signal line is disclosed. A state machine records previous bits that were transmitted over the line. If the bit on the line has been static for several clock cycles, the slew rate will be increased to facilitate correct reading of the bit for the next clock cycle. If the bit on the line has been dynamic for the previous bits, the slew rate will be a lower slew rate to avoid crosstalk between neighboring lines.

Abstract: Various embodiments include apparatus and methods having circuitry to test continuity of conductive paths coupled to dice arranged in a stack.

Abstract: Data digits and correction digits are received in each of a number of integrated circuit (IC) devices. Apparatus, systems, and methods are disclosed that operate to check the data digits for error in each IC device according to an algorithm associated with the IC device, the algorithm being different for each IC device. Each IC device will act in response to the data digits if no error is detected in the data digits. Additional apparatus, systems, and methods are disclosed.

Abstract: Various embodiments include apparatus and methods having circuitry to test continuity of conductive paths coupled to dice arranged in a stack.

Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.

Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.