Abstract: Mutual capacitance touch sensor circuits are used in manufacturing displays, including touch screen displays, such as LED, LCD, plasma, 3D, and other displays used in computing as well as stationary and portable electronic devices. A flexographic printing process may be used, for example, in a roll to roll handling system to print geometric patterns on a substrate, for example, a flexible dielectric substrate. These patterns may then be coated with a conductive material by, for example, an electroless plating process.

Abstract: A method of fabricating a conductive pattern includes disposing an image of the conductive pattern on a substrate. The image includes material capable of being electroless plated. The image is electroless plated with a first metal forming a first plated image. The first plated image is electroless plated with a second metal forming a second plated image. The second metal passivates the first metal. The second plated image is bathed in an immersion bath comprising a darkening material.

Abstract: A method of printing uniform line widths with angle effect includes transferring ink to a flexo master comprising printing patterns disposed at an adjusted angle relative to a directional printing axis and transferring ink from the flexo master to a substrate. A flexographic printing system includes an ink roll, an anilox roll, a plate cylinder, a flexo master, and an impression cylinder. The flexo master is disposed on a plate cylinder. The flexo master includes printing patterns disposed at an adjusted angle relative to a directional printing axis.

Abstract: A method of fabricating copper-nickel mesh conductors includes printing a patterned ink seed layer on a substrate. Electroless copper is plated on the printed patterned ink seed layer. A predetermined thickness of electroless nickel is plated on the plated electroless copper.

Abstract: A multi-station flexographic printing method includes transferring an ink from a first flexo master to a substrate. The first flexo master includes an embossing pattern. The embossing pattern includes lines of a first width or orientation. Ink is transferred from a second flexo master to the substrate. The second flexo master includes an embossing pattern. The embossing pattern includes lines of a second width or orientation. Ink is transferred from a third flexo master to the substrate. The third flexo master includes an embossing pattern. The embossing pattern includes lines of a third width or orientation. Ink is transferred from a fourth flexo master to the substrate. The fourth flexo master includes an embossing pattern. The embossing pattern includes lines of a fourth width or orientation.

Abstract: A method of printing intersecting lines with angle effect includes transferring ink to a flexo master. The flexo master includes embossing patterns disposed at an adjusted angle relative to an x-y axis. Ink is transferred from the flexo master to a substrate.

Abstract: A method of inverse image flexographic printing includes transferring an insulating ink to a plurality of inverse printing patterns disposed on a flexo master. The insulating ink is transferred from the plurality of inverse printing patterns to a substrate. The insulating ink disposed on the substrate is cured. A catalytic ink is deposited on a plurality of exposed portions of the substrate. The catalytic ink deposited on the substrate is electroless plated.

Abstract: Method of manufacturing a resistive touch sensor circuit using a roll to roll process to print microscopic patterns on a single side of at least one flexible dielectric substrate using a plurality of flexo-masters to print the microscopic patterns which are then plated to form conductive microscopic patterns.

Abstract: A method includes forming a master embossing roller to have a predetermined pattern, coating a flexible unpatterned substrate with a catalyst coating layer and forming a corresponding pattern in the coated substrate using the master embossing roller to thereby form a patterned substrate. The method may also include electrolessly plating the patterned substrate.

Abstract: In a flexographic printing system, the both the process parameters and equipment setup and configuration may play a role in producing the desired printed pattern. One component of the equipment setup is the printer roller assembly which may comprise a roller and a flexoplate as well as tape. The properties of the flexoplate and the tape as well as the relative dimensions of each in the assembly may affect the geometry and quality of the transferred pattern, as well as the ability of the system to produce a pattern on a repeatable, consistent basis.

Abstract: The disclosure disclosed herein is a method for altering the optical properties of high resolution printed conducting patterns by initiating a chemical reaction to a passivating layer on the patterns with optical properties differing from the untreated material. The electrical properties are maintained after this reacted, passivating, layer is formed.

Abstract: A system and method of preparing a flexoplate so it is suitable for the printing of high resolution patterns. The method includes controlling the curing conditions of the flexoplate, thereby controlling the properties of said flexoplate such as floor thickness, pattern cross-sectional geometry, repeatability of printed features during the printing process, and durability of the flexoplate during the printing process.

Abstract: A method includes forming a master embossing roller to have a predetermined pattern, coating a flexible unpatterned substrate with a catalyst coating layer and forming a corresponding pattern in the coated substrate using the master embossing roller to thereby form a patterned substrate. The method may also include electrolessly plating the patterned substrate.

Abstract: A method for forming a conductive pattern on a substrate surface comprises altering the surface energy of the substrate surface, depositing a catalyst-doped liquid on to said substrate surface; forming a seed layer from said deposited catalyst-doped liquid, and plating the seed layer thereby forming the conductive pattern. In some embodiments, 3-D structures are placed on the substrate to delimit the size and shape of the conductive pattern. In other embodiments, the surface energy of the areas of the substrate in which conductive material is not desired (i.e., inverse pattern) is altered (e.g., lowered) to avoid having conductive liquid adhere thereto.

Abstract: Specular and diffuse reflection and fingerprints are reduced associated with a display are reduced through the use of any or all of an anti-reflection (AR) coating, a self-assembled monolayer (SAM) coating, and micro-structures to selectively deflect or diffract the incident light.

Abstract: A method for forming a dielectric layer onto a substrate having a silicon surface includes initially depositing an oxidizable metal thin film onto the surface and thereafter depositing a thin film of a metal titanate compound, such as the zirconium titanate. The metal thin film is preferably formed of tantalum, titanium or zirconium. Following deposition of the metal titanate thin film, the metal titanate is annealed by heating in an oxidizing atmosphere at a temperature effective to recrystalize the titanate to increase the dielectric properties. During annealing, the metal film reacts with oxygen to form a metal oxide thin film intermediate the metal titanate thin film and the silicon surface. The oxidation of the metal thin film inhibits oxidation of the underlying silicon that would otherwise reduce the effective capacitance of the dielectric layer.

Abstract: A piezoelectric device, such as a surface acoustic wave filter, comprises a piezoelectric film composed of a lead zirconium titanate compound applied to a substrate formed of silicon or gallium arsenide. The device includes an intermediate film between the piezoelectric film and the substrate and composed of a lead-free zirconium titanate compound to prevent interaction between lead oxide in the piezoelectric material and the material of the substrate that would otherwise cause spilling or adversely effect the electrical properties of the substrate. The piezoelectric device is made by first applying the film of the lead-free zirconium titanate compound and thereafter applying the film of the lead zirconium titanate compound. Preferably, the lead-free zirconium titanate film is applied by sputtering and annealed to densify the material and increase the dielectric constant prior to depositing the piezoelectric material.

Abstract: A piezoelectric device, such as a surface acoustic wave filter, comprises a piezoelectric film composed of a lead zirconium titanate compound applied to a substrate formed of silicon or gallium arsenide. The device includes an intermediate film between the piezoelectric film and the substrate and composed of a lead-free zirconium titanate compound to prevent interaction between lead oxide in the piezoelectric material and the material of the substrate that would otherwise cause spalling or adversely effect the electrical properties of the substrate. The piezoelectric device is made by first applying the film of the lead-free zirconium titanate compound and thereafter applying the film of the lead zirconium titanate compound. Preferably, the lead-free zirconium titanate film is applied by sputtering and annealed to densify the material and increase the dielectric constant prior to depositing the piezoelectric material.