Abstract: A camera module includes an image sensor, a lens assembly, a printed circuit board, and a substrate. The image sensor has edges that define a two-dimensional footprint substantially parallel to a surface of the image sensor. The lens assembly is coupled to a top surface of the image sensor and focuses light onto the top surface of the image sensor. Edges of the lens assembly do not extend beyond the footprint. The printed circuit board is below the image sensor and controls the image sensor. The substrate is coupled to a bottom surface of the image sensor and to a top surface of the printed circuit board. The substrate electrically couples the image sensor to the printed circuit board. Edges of the substrate do not extend beyond the footprint.

Abstract: Systems and methods for testing a light emitting device are described. A processing device receives a receiving an image of a beam of light substantially free of parallax distortion and determines one or more uniformity metrics of the beam of light based on the received image.

Abstract: An phase detect (PD) module including a phase detect (PD) lens, PD image sensor, and a PD controller is disclosed. The PD module may be configured to provide a control signal to an electromechanical device, such as a voice coil motor (VCM), of an image capture module to move a lens assembly to focus an image of an object to be imaged onto a primary image sensor. The PD module may direct the capture of a PD image by the PD image sensor and perform a phase detect (PD) technique on the captured AF image to identify a focus point of the lens assembly. This determined focus point may be used to displace the lens assembly relative to the primary image sensor to achieve focus of the object onto the primary image sensor.

Abstract: Systems and methods for testing a light emitting device are described. A processing device receives image data from an image capturing device of an electronic device. The image data represents of an image of a projection, on a projection surface, of beam of light emitted by a light emitting device of the electronic device. The processing device determines one or more imaging calibration parameters based on the image.

Abstract: Embodiments of the disclosure permit automated focusing of a camera module during assembly. The camera module can include an imaging device and a lens assembly that is movably mounted to a housing of the camera module. In certain embodiments, the automated focusing can include iteratively imaging a fixed set of reference markings, and successively quantifying the focusing quality of the camera module based at least on a defocus metric defined as a difference between a current spacing and a calibrated spacing among two of the imaged reference markings. The magnitude and sign of the defocus metric can guide, respectively, a magnitude and direction of the movement of the lens assembly relative to the imaging device. After successive adjustments yield a desired focusing quality of the camera module, the lens assembly can be locked in position and can be further processed according to a suitable camera module integration flow.

Abstract: A single dual-sided image sensor is shared by two cameras to capture images using both a front-side and a back-side of the image sensor. At different times, the image sensor is front-side illuminated by one camera to capture a first image, and back-side illuminated by the other camera to capture a second image. The two cameras, as configured in a device, face in a same direction, but are spatially offset.

Abstract: Various embodiments are directed to a camera module, image sensor die, and methods for manufacturing the same. The image sensor die comprises a thinned wafer portion, a photosensor portion adjacent the thinned wafer portion and a carrier wafer. Vias may be formed through the carrier wafer to connect the photosensor portion to die contacts. A first side of the image sensor die opposite the die contacts may be bonded to a first side of the rigid substrate. Wire bonds may be formed between the die contacts and substrate-sensor contacts positioned on the first side of the rigid substrate.

Abstract: A single dual-sided image sensor simultaneously captures discrete images from two different perspectives using both a front-side and a back-side of the image sensor. The two different perspectives are extracted from a composite image for processing. The two cameras, as configured in a device, face in a same direction and are spatially offset.