Abstract: Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.

Abstract: A system assembly for the retention of heatsinks, in particular, high-mass heatsinks, is disclosed. The system assembly includes a backplate with standoffs extending transverse to a system board, for securing a heatsink to the system board. The standoffs effectively distribute the mass of the heatsink away from the system board, the processor, and socket, minimizing damage to these components. A TIM spring disposed within the backplate provides upward pressure to the system assembly to uniformly spread a thermal interface material between the processor and the heatsink, thereby facilitating effective heat transfer.

Abstract: A system assembly for the retention of heatsinks, in particular, high-mass heatsinks, is disclosed. The system assembly includes a backplate with standoffs extending transverse to a system board, for securing a heatsink to the system board. The standoffs effectively distribute the mass of the heatsink away from the system board, the processor, and socket, minimizing damage to these components. A TIM spring disposed within the backplate provides upward pressure to the system assembly to uniformly spread a thermal interface material between the processor and the heatsink, thereby facilitating effective heat transfer.

Abstract: A computer platform according to this invention includes a plurality of electronic components. A platform housing is divided into isolated thermal partitions, including a core partition and a non-core partition. One or more of the electronic components are located within each of the core and non-core partitions. These partitions provide an isolated thermal environment allowing for independent control of the thermal characteristics, including a temperature, of that environment. The computer platform can also include a remote cooling partition having a cooling system for cooling a processor of the platform. A modular computer platform can also be provided in which the core, non-core, and remote cooling partitions are readily attachable and detachable from each other.

Abstract: A managed modular sub-environment for a computer system. In one embodiment, a plurality of modular managed sub-environments are included within an outer enclosure of a computer system. In one embodiment, the modular managed sub-environments have a managed thermal environment and a managed electromagnetic interference (EMI) environment. The computer system components enclosed within each sub-environment are less likely to be affected by the EMI or thermal energy from another neighboring sub-environment. Each of the plurality of modular managed sub-environments are coupled to a computer system backplane including a common bus, which distributes communications and power among the plurality of modular managed sub-environments.

Abstract: A computer platform according to this invention includes a housing. A CPU board is located within the housing and a power pod assembly is located adjacent a first side of the CPU board. A CPU socket is located on a second side of the CPU board, opposite the first side of the CPU board. A processor is mounted within the CPU socket and arranged in electrical communication with the power pod. A cooling device located adjacent the processor on the second side of the CPU board, and is configured to cool the processor. A processor arrangement for a computer platform is also provided which includes a CPU board having a processor mounted on the CPU board. A biasing mechanism supplies a biasing force against the processor to maintain it in thermal communication with a cooling device.

Abstract: A managed modular sub-environment for a computer system. In one embodiment, a plurality of modular managed sub-environments are included within an outer enclosure of a computer system. In one embodiment, the modular managed sub-environments have a managed thermal environment and a managed electromagnetic interference (EMI) environment. The computer system components enclosed within each sub-environment are less likely to be affected by the EMI or thermal energy from another neighboring sub-environment. Each of the plurality of modular managed sub-environments are coupled to a computer system backplane including a common bus, which distributes communications and power among the plurality of modular managed sub-environments.

Abstract: An improved assembly for a computer that includes a motherboard having a first side and a second side. The first side has a first portion and a second portion. The first portion contains components capable of generating substantial heat and a strong electric field. The assembly further includes an EMI attenuating cover that encloses the first portion of the first side of the motherboard, but does not enclose the second portion of the first side of the motherboard.

Abstract: A battery powered electronic lock system includes a battery monitoring feature that detects three states of the lock system battery. These states correspond to three progressively weaker states of the battery. When the battery is in the first state, the lock system operates in normal fashion. When the battery is in the second state, an indicator informs the user, but operation of the lock system otherwise continues in substantially normal fashion. When the battery is in the third state, normal lock operation is curtailed and the remaining battery energy is reserved for the purpose of opening the lock for specially authorized keys.

Abstract: An electronic key for an electronic lock system is provided with graphical user interface which can display a plurality of symbols corresponding to a plurality of functions that the key can cause the lock to execute. An operator of the key moves a visual indicia among these symbols to select a desired function. The key then transmits instructions to the lock causing the selected function to be executed.

Abstract: Battery power in an electronic lock system is conserved by delaying application of energy to the unlocking mechanism until a movable member, used to open the lock system, is moved.

Abstract: A comprehensive real estate lockbox system is disclosed which provides a variety of operational features. Some of these features include the ability to: record all accesses to all lockboxes; transfer all or part of such records from the lockboxes to a supervising real estate agency or board; organize and review such records; facilitate operation of lockboxes that are mounted in awkward or poorly lit locations; limit lockbox accesses to preselected agents, agencies or boards; reprogram lockboxes in the field; monitor redundantly the status of the lockbox battery; record diagnostic information on each operation of a lockbox or key; render keys inoperative on predetermined dates; disable unauthorized keys; grant agents from remote real estate boards permission to open certain lockboxes, and; grant different keys different privileges.