Patents by Inventor Edgardo L. Chua Ching Chua

Edgardo L. Chua Ching Chua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package having surface-mount blocking elements
    Patent number: 9620462
    Abstract: A first cavity-down ball grid array (BGA) package includes a substrate member and an array of bond balls. The array of bond balls includes a pair of parallel extending rows of outer mesh bond balls and a row of inner signal bond balls that is parallel to the pair of rows of outer mesh bond balls. A surface-mount blocking element is disposed between the row of inner signal bond balls and the pair of rows of outer mesh bond balls. The surface-mount blocking element is either a passive or an active component of the BGA package. In one example, the first cavity-down BGA package is surface-mounted to a second cavity-down BGA package to form a package-on-package (POP) security module. The surface-mount blocking element provides additional physical barrier against the probing of the inner signal bond balls. Sensitive data is therefore protected from unauthorized access.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: April 11, 2017
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Ruben C. Zeta, Edgardo L. Chua Ching Chua
  • Integrated circuit package having surface-mount blocking elements
    Publication number: 20150050777
    Abstract: A first cavity-down ball grid array (BGA) package includes a substrate member and an array of bond balls. The array of bond balls includes a pair of parallel extending rows of outer mesh bond balls and a row of inner signal bond balls that is parallel to the pair of rows of outer mesh bond balls. A surface-mount blocking element is disposed between the row of inner signal bond balls and the pair of rows of outer mesh bond balls. The surface-mount blocking element is either a passive or an active component of the BGA package. In one example, the first cavity-down BGA package is surface-mounted to a second cavity-down BGA package to form a package-on-package (POP) security module. The surface-mount blocking element provides additional physical barrier against the probing of the inner signal bond balls. Sensitive data is therefore protected from unauthorized access.
    Type: Application
    Filed: October 8, 2013
    Publication date: February 19, 2015
    Applicant: Maxim Integrated Products, Inc.
    Inventors: Ruben C. Zeta, Edgardo L. Chua Ching Chua
  • Integrated circuit package having surface-mount blocking elements
    Patent number: 8552566
    Abstract: A first cavity-down ball grid array (BGA) package includes a substrate member and an array of bond balls. The array of bond balls includes a pair of parallel extending rows of outer mesh bond balls and a row of inner signal bond balls that is parallel to the pair of rows of outer mesh bond balls. A surface-mount blocking element is disposed between the row of inner signal bond balls and the pair of rows of outer mesh bond balls. The surface-mount blocking element is either a passive or an active component of the BGA package. In one example, the first cavity-down BGA package is surface-mounted to a second cavity-down BGA package to form a package-on-package (POP) security module. The surface-mount blocking element provides additional physical barrier against the probing of the inner signal bond balls. Sensitive data is therefore protected from unauthorized access.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: October 8, 2013
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Ruben C. Zeta, Edgardo L. Chua Ching Chua