Abstract: The invention relates to a method of performing an assay for a compound. The method makes use of a device (390) which has a plurality of wells (340) which contain cells, and according to the method a liquid is transferred from the wells (340) to a substrate which is used to perform the assay. Each well (340) of the device comprises a bottom provided with a through-hole (370) extending from the well (340) to the backside of the device (390). Liquid containing the compound is transferred via the through-holes (370) to the substrate.

Abstract: A method of manufacturing a MEMS device comprising a main body and a protrusion. To provide a generic method of manufacturing a protrusion with reduced vulnerability, the method includes creating a recess in a wafer substrate, said recess having an upper recess section and a lower recess section. The upper recess section is created using anisotropic etching and the lower recess section is formed using corner lithography followed by directional etching. Finally, a filler material is introduced in the recess and at least part of the wafer substrate material is removed so as to expose the filler material introduced in the recess. Additionally, the method allows for the batch-wise production of protrusions having oblique ends.

Abstract: A method of manufacturing a micro-fluidic probe that is relatively simple comprises providing a pyramidal pit in a substrate with a structural layer. Then metal masking layers using directionally depositing are provided. The angles of deposition are chosen such that for one deposition step the walls are covered but at least one wall is left less or not exposed, whereas for the other deposition said at least one wall is covered except for a bottom section thereof. Thus these deposited layers can be used as masks for etching the structural layer.

Abstract: A method of providing a MEMS device, such as an AFM probe, having a three-sided pyramidal protrusion is made using a multitude of MEMS method steps. To allow the reliable and speedy manufacture of such a MEMS device having a three-sided protrusion on a massive scale, wherein the protrusion has a relatively small half-cone angle and a single apex, a mold is used. The mold includes a sacrificial layer on top of a base substrate. The method of providing the MEMS device includes: providing an area at the first side of the mold which area comprises a pit with a layer of protrusion material, patterning the layer of protrusion material to the desired shape, and isotropically etching the sacrificial layer of the mold with an isotropic etchant capable of etching the sacrificial layer so as to separate the MEMS device from at least the base substrate of the mold.

Abstract: A method of providing a MEMS device including a through-hole in a layer of structural material using a multitude of MEMS method steps. A versatile method to create a through-hole, in particular a multitude thereof, involves a step of exposing a polymeric layer of positive photoresist in a direction from the outer surface of the positive photoresist to light resulting in an exposed layer of positive photoresist including relatively strongly depolymerized positive photoresist in the top section of a recess while leaving relatively less strongly depolymerized positive photoresist in the bottom section of the recess.

Abstract: A method of providing a MEMS device including a through-hole in a layer of structural material using a multitude of MEMS method steps. A versatile method to create a through-hole, in particular a multitude thereof, involves a step of exposing a polymeric layer of positive photoresist in a direction from the outer surface of the positive photoresist to light resulting in an exposed layer of positive photoresist including relatively strongly depolymerized positive photoresist in the top section of a recess while leaving relatively less strongly depolymerized positive photoresist in the bottom section of the recess.

Abstract: A method of performing an assay for a compound using a device (390) comprising with a plurality of wells (340), said plurality of wells (340) containing cells, and liquid is transferred liquid from the wells (340) to a substrate, which substrate is used to perform the assay. The method is performed using a device (390) wherein each well (340) comprises a bottom provided with a through-hole (370) extending from the well (340) to the backside (392) of the device (390). Liquid containing the compound is transferred via the through-holes (370) to the substrate. Preferably a cell is present in a well (340) and compound excreted by the cell in the well (340) is detected.

Abstract: A method of manufacturing a plurality of through-holes in a layer of first material by subjecting part of the layer of said first material to ion beam milling. For batch-wise production, the method comprises after a step of providing the layer of first material and before the step of ion beam milling, providing a second layer of a second material on the layer of first material, providing the second layer of the second material with a plurality of holes, the holes being provided at central locations of pits in the first layer, and subjecting the second layer of the second material to said step of ion beam milling at an angle using said second layer of the second material as a shadow mask.

Abstract: A method of manufacturing a plurality of through-holes in a layer of first material, for example for the manufacturing of a probe comprising a tip containing a channel. To manufacture the through-holes in a batch process, a layer of first material is deposited on a wafer comprising a plurality of pits a second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits; using the second layer as a shadow mask when depositing a third layer at an angle, covering a part of the first material with said third material at the central locations, and etching the exposed parts of the first layer using the third layer as a protective layer.

Abstract: A method of manufacturing a plurality of through-holes in a layer of first material, for example for the manufacturing of a probe comprising a tip containing a channel. To manufacture the through-holes in a batch process, a layer of first material is deposited on a wafer comprising a plurality of pits a second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits; using the second layer as a shadow mask when depositing a third layer at an angle, covering a part of the first material with said third material at the central locations, and etching the exposed parts of the first layer using the third layer as a protective layer.

Abstract: A method of manufacturing a plurality of through-holes in a layer of first material by subjecting part of the layer of said first material to ion beam milling. For batch-wise production, the method comprises after a step of providing the layer of first material and before the step of ion beam milling, providing a second layer of a second material on the layer of first material, providing the second layer of the second material with a plurality of holes, the holes being provided at central locations of pits in the first layer, and subjecting the second layer of the second material to said step of ion beam milling at an angle using said second layer of the second material as a shadow mask.

Abstract: The present invention relates to a method of manufacturing a probe comprising a cantilever with a conduit. According to the invention, an etchant window is provided in a layer covering an elongated sacrificial conduit core that is to form the conduit. This allows for an etching process where the elongated sacrificial conduit core is etched away before all material of a substrate is etched away, the remaining material of the substrate material making the probe stronger without being in the way during use of the probe.

Abstract: The present invention relates to a method of manufacturing a probe comprising a cantilever with a conduit. According to the invention, an etchant window is provided in a layer covering an elongated sacrificial conduit core that is to form the conduit. This allows for an etching process where the elongated sacrificial conduit core is etched away before all material of a substrate is etched away, the remaining material of the substrate material making the probe stronger without being in the way during use of the probe.