Abstract: An insulated heat bondable electrically conductive material includes an electrically conductive substrate, a base coat on the substrate of electrically insulating, heat resistant, cured resin, and an overcoat of heat curable acrylic polymer upon the base coat forming a heat bondable acrylic polymer coating thereon.The disclosure also includes: an insulated heat bondable magnet wire; a bondable enamel coated, insulated electrical conductor; an article; a dynamoelectric machine; a method of making an insulated, heat bondable metal substrate; and, a method of self-bonding a plurality of turns of a magnet wire.

Abstract: Wire coating formulations are provided by heating a mixture of aromatic dianhydride, water and a monoalkyl glycol ether, followed by the addition of organic diamine. The resulting mixture is a stable wire coating enamel capable of forming flexible wire enamels upon cure.

Abstract: Wire coating formulations are provided by heating a mixture of aromatic dianhydride, water and a monoalkyl glycol ether, followed by the addition of organic diamine. The resulting mixture is a stable wire coating enamel capable of forming flexible wire enamels upon cure.

Abstract: Finely divided polyetherimide is provided which can be used in a variety of applications. These oligomers, in the form of fine powders, are particularly useful for coating wire by a power coating technique.

Abstract: Finely divided polyetherimide is provided which can be used in a variety of applications. These oligomers, in the form of fine powders, are particularly useful for coating wire by a powder coating technique.

Abstract: Disclosed is a solution including an aromatic bis (ether dicarboxylic acid) component, an organic diamine component and a solvent system including a water-soluble organic solvent component, which may be a dipolar aprotic solvent or a monoalkyl ether of ethylene glycol or of diethylene glycol, and optionally water. The solution may be coated on a substrate and polymerized to form high quality polyetherimide coatings.

Abstract: An improved substantially solvent-free process for preparing phthalate-moiety based polyesterimide resins, new resins prepared by the process, and substrates (e.g., electrical conductors) coated with compositions comprising the new resins are described.

Abstract: Disclosed is a solution including an aromatic bis (ether dicarboxylic acid) component, an organic diamine component and a solvent system including a water-soluble organic solvent component, which may be a dipolar aprotic solvent or a monoalkyl ether of ethylene glycol or of diethylene glycol, and optionally water. The solution may be coated on a substrate and polymerized to form high quality polyetherimide coatings.

Abstract: This invention is concerned with a new class of polyetheramide-imide phenolic resin blends. More particularly, the invention is concerned with polyetheramide-imide phenolic resin blends which exhibit melt viscosities suitable for solventless-dry powder coating and curing of polyetherimide insulating films on various substrates. The polyetheramide-imide phenolic resin blends are also suitable for the manufacture of filaments, fibers, films, molding compounds, coatings, etc.

Abstract: Disclosed is a solution consisting essentially of a liquid ether solvent and dissolved therein a polyetheramide-acid-imide prepared by reacting at least one aromatic bis(ether anhydride) with at least one organic diamine. Also disclosed is a process for preparing the solution wherein the reaction is carried out in the ether solvent. The solution may be employed as a wire coating enamel.

Abstract: This invention is concerned with a new class of polyetheramide-imide phenolic resin blends. More particularly, the invention is concerned with polyetheramide-imide phenolic resin blends which exhibit melt viscosities suitable for solventless-dry powder coating and curing of polyether-imide insulating films on various substrates. The polyetheramide-imide phenolic resin blends are also suitable for the manufacture of filaments, fibers, films, molding compounds, coatings, etc.

Abstract: Disclosed is a solution including an aromatic bis (ether dicarboxylic acid) component, an organic diamine component and a solvent system including a water-soluble organic solvent component, which may be a dipolar aprotic solvent or a monoalkyl ether of ethylene glycol or of diethylene glycol, and optionally water. The solution may be coated on a substrate and polymerized to form high quality polyetherimide coatings.

Abstract: This invention is concerned with a new class of polyetheramide-imide epoxy resin blends. More particularly, the invention is concerned with polyetheramide-imide epoxy resin blends which exhibit melt viscosities suitable for solventless-dry powder coating and curing of polyetherimide insulating films on various substrates. The polyetheramide-imide epoxy resin blends are also suitable for the manufacture of filaments, fibers, films, molding compounds, coatings, etc.

Abstract: Disclosed is a solution consisting essentially of a liquid ether solvent and dissolved therein a polyetheramide-acid-imide prepared by reacting at least one aromatic bis(ether anhydride) with at least one organic diamine. Also disclosed is a process for preparing the solution wherein the reaction is carried out in the ether solvent. The solution may be employed as a wire coating enamel.

Abstract: A method is provided for converting a polyimide to the corresponding polyamide acid salt, utilizing a predetermined amount of a strong base. The polyamide acid salt can be converted to the corresponding polyamide acid. The polyamide acid and polyamide acid salts provided by the subject method can be converted to the polyimide state after being applied to various substrates by standard dipcoating and electrocoating techniques. When utilized with a potentiometric titrator, the method of the invention also can be used to determine imide functionality of polyimide.

Abstract: Disclosed is a curable resinous coating composition which includes a polyester resin and a relatively small amount of a titanium-containing curing agent and optionally includes a surfactant and/or a powder free-flow agent. The composition is characterized with a suitable balance of cure rate and melt flow properties for powder coating and curing to form insulating films on magnet wire and other substrates.

Abstract: A method is provided for making stable electrocoatable polyimide mixtures having a high water content. A solution of polyimide in a dipolar aprotic solvent is heated in the presence of base resulting in a transitory viscosity decrease. Major amounts of water can thereafter be added to the mixture during its reduced viscosity state to produce a stable aqueous mixture.

Abstract: A method is described for maintaining or restoring a polyamide acid salt electrocoating bath which has either deteriorated, or is being used continuously for electrocoating purposes. Improved results are achieved by flowing the electrocoating bath through an anion exchange resin having a particular cross-link density thereby maintaining or increasing the weight percent solids generated in the electrodeposit.