Patents by Inventor Edmund J. Sobresky

Edmund J. Sobresky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6138352
    Abstract: An extruded, tiered high fin density heat sink (10) uses extruded first base, second base and bridging elements (12, 16, 14) having an arrangement of closely spaced, parallel fins (20, 26, 32, 38) and recesses (22, 28, 34, 40) for receiving opposing fins in the elements. The fins (20, 38) in the first and second base elements (12, 16) are bonded to recesses (28, 34) in opposite common faces (24, 30) of bridging elements (14) while fins (26, 32) extending from both opposing faces (24, 30) of bridging element (14) are bonded in aligned recesses (22, 40) in the first and second base element (12, 16) forming an extruded, tiered, high fin density heat sink (10).
    Type: Grant
    Filed: January 5, 1999
    Date of Patent: October 31, 2000
    Assignee: Eastman Kodak Company
    Inventors: Dean L. Smith, Edmund J. Sobresky, Roger S. Kerr
  • Patent number: 6050332
    Abstract: An extruded, tiered high fin density heat sink (10) uses extruded first base, second base and bridging elements (12, 16, 14) having an arrangement of closely spaced, parallel fins (20, 26, 32, 38) and recesses (22, 28, 34, 40) for receiving opposing fins in the elements. The fins (20, 38) in the first and second base elements (12, 16) are bonded to recesses (28, 34) in opposite common faces (24, 30) of bridging elements (14) while fins (26, 32) extending from both opposing faces (24, 30) of bridging element (14) are bonded in aligned recesses (22, 40) in the first and second base element (12, 16) forming an extruded, tiered, high fin density heat sink (10).
    Type: Grant
    Filed: August 2, 1999
    Date of Patent: April 18, 2000
    Assignee: Eastman Kodak Company
    Inventors: Dean L. Smith, Edmund J. Sobresky, Roger S. Kerr
  • Patent number: 6009938
    Abstract: An extruded, tiered high fin density heat sink (10) uses extruded first base, second base and bridging elements (12, 16, 14) having an arrangement of closely spaced, parallel fins (20, 26, 32, 38) and recesses (22, 28, 34, 40) for receiving opposing fins in the elements. The fins (20, 38) in the first and second base elements (12, 16) are bonded to recesses (28, 34) in opposite common faces (24, 30) of bridging elements (14) while fins (26, 32) extending from both opposing faces (24, 30) of bridging element (14) are bonded in aligned recesses (22, 40) in the first and second base element (12, 16) forming an extruded, tiered, high fin density heat sink (10).
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: January 4, 2000
    Assignee: Eastman Kodak Company
    Inventors: Dean L. Smith, Edmund J. Sobresky, Roger S. Kerr
  • Patent number: 5995367
    Abstract: An improved heat exchanger (10) has an extruded, multi-tiered heat sink (22) having a very high heat transfer coefficient structurally associated with a compact, high air velocity air moving means (14). Heat sink (22) has a first tier (56) formed by first fins (34) in a first base element (24) closely spaced apart from third fins (40) in an extruded bridging element (30). A second tier (60) of heat sink (22) is formed by second fins (52) in a second base element (26) closely spaced from fourth fins (46) opposing the third fins (40) in the bridging element (30). Air moving means (16) of the invention employs a backward curved impeller (14) driven by a compact planar dc motor (80) adapted to yield higher than normal impeller speeds with superior thermal transfer performance.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: November 30, 1999
    Assignee: Eastman Kodak Company
    Inventors: Dean L. Smith, Edmund J. Sobresky, Roger S. Kerr
  • Patent number: 5988266
    Abstract: A high performance, high pin fin density heat sink (10) has mating first and second opposing base members (22, 24) having first and second pin fins (18, 20) extending generally perpendicularly therefrom. The pin fins (18, 20) are generally cylindrical and each bonded into recesses (30,32) formed on the opposing base member (22, 24). The spaces between nearest adjacent first and second pin fins (18, 20) form narrow fluid passageways (12) having a gas inlet in (14) for communicating with a heat generating body and gas out let end (16).
    Type: Grant
    Filed: August 5, 1998
    Date of Patent: November 23, 1999
    Assignee: Eastman Kodak Company
    Inventors: Dean L. Smith, Edmund J. Sobresky, Roger S. Kerr
  • Patent number: 5937517
    Abstract: A method of manufacturing a high performance, high fin density heat sink (10) uses extruded first and second base elements having an alternating arrangement of closely spaced fins and recesses for receiving opposing fins. The fins in the first and second base elements are bonded to the recesses formed in the common face of the opposing base element to form the bonded extruded heat sink.
    Type: Grant
    Filed: November 12, 1997
    Date of Patent: August 17, 1999
    Assignee: Eastman Kodak Company
    Inventors: Dean L. Smith, Edmund J. Sobresky, Roger S. Kerr
  • Patent number: 5829514
    Abstract: A high performance, high pin fin density heat sink (10) has mating first and second opposing base members (22, 24) having first and second pin fins (18, 20) extending generally perpendicularly therefrom. The pin fins (18, 20) are generally cylindrical and each bonded into recesses (30, 32) formed on the opposing base member (22, 24). The spaces between nearest adjacent first and second pin fins (18, 20) form narrow fluid passageways (12) having a gas inlet in (14) for communicating with a heat generating body and gas out let end (16).
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: November 3, 1998
    Assignee: Eastman Kodak Company
    Inventors: Dean L. Smith, Edmund J. Sobresky, Roger S. Kerr
  • Patent number: 4309111
    Abstract: An apparatus to facilitate the grading of coins which takes the form of a thin planar housing which has an elongated rectangularly shaped recess within its upper planar surface. Adjacent the elongated recess is located a plurality of standard graded master coin replicas, made in accordance with certain accepted standards, which are sequentially arranged from the greatest wear condition to the least wear condition, such as "very good", "fine", "very fine", and "extra fine". A block is located within the recess and is movable longitudinally along the entire length of the recess. Upon the block is to be located the coin which is to be graded. This coin is capable of being positioned directly adjacent each specimen. The observer can then accurately determine the precise wear level of this coin. The block is maintained in continuous contact with the recess through the use of a ridge and groove assembly.
    Type: Grant
    Filed: March 19, 1980
    Date of Patent: January 5, 1982
    Inventor: Edmund J. Sobresky, Sr.