Patents by Inventor Edmund W. Chu

Edmund W. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130236712
    Abstract: Disclosed herein are metal laminates, and methods related thereto. The metal laminates have a cold rolled steel substrate having at least a first side and a second side; a backer coating disposed upon at least a portion of the first side of the cold rolled steel substrate; an adhesive disposed upon at least a portion of the second side of the cold rolled steel substrate; and an aluminum metal layer having at least a first side and a second side, at least a portion of the first side of the aluminum metal layer contacts at least a portion of the adhesive.
    Type: Application
    Filed: March 6, 2012
    Publication date: September 12, 2013
    Inventors: Daniel Serafin, Janell Abbott, Robert Bombalski, Al Askin, Edmund W. Chu
  • Publication number: 20100043939
    Abstract: The present invention discloses a method for producing a wing structure comprising producing a machined metallic bottom skin by pre-machinmg, preforming or combinations thereof, finishing the skin which serves as a mold, placing a plurality of straps on top of the skin, arranging a monolithic, fiber metal laminate, or non-reinforced metallic laminate skin on top of the plurality of straps to form a module, and curing the module, wherein the bottom skin is the load carrying element in the wing The present invention also discloses a method for producing a wing structure comprising providing a mold, placing a first monolithic, fiber metal laminate, or non-reinforced metallic laminate skin on a lay-up mold, placing a plurality of straps on top of the skin, arranging a second monolithic, fiber metal laminate, or non-reinforced metallic laminate skin on top of the plurality of straps to form a module, and curing the module.
    Type: Application
    Filed: May 15, 2007
    Publication date: February 25, 2010
    Applicant: ALCOA, INC.
    Inventors: Markus B. Heinimann, Michael Kulak, Edmund W. Chu, John T. Siemon
  • Publication number: 20090211697
    Abstract: The present invention discloses a method for producing an aircraft wing hybrid structure comprising the steps of producing a machined metallic bottom skin by either (i) pre-machining, (ii) preforming or (iii) combinations thereof, finishing the machined metallic bottom skin, providing a finished machined metallic bottom skin that serves as a lay-up mold, placing a plurality of core straps on top of the finished machined metallic bottom skin, arranging a skin that is selected from the group consisting of a monolithic skin, a fiber metal laminate skin and a non-reinforced metallic laminate skin on top of the plurality of cores strap to form a module, and curing the module, wherein the finished machined metallic bottom skin is the load carrying element in the aircraft wing hybrid structure.
    Type: Application
    Filed: May 15, 2007
    Publication date: August 27, 2009
    Inventors: Markus B. Heinimann, Michael Kulak, Edmund W. Chu, John T. Siemon
  • Patent number: 7194388
    Abstract: A method for determining a die profile for forming a metal part having a desired shape. The method includes the steps of providing a nominal die profile, determining a springback profile based on the nominal die profile and employing a compensation strategy to determine the die profile based on the nominal die profile and the springback profile. There are disclosed five (5) compensation strategies: (1) a reversed die-normal technique; (2) a reversed radial rotation technique; (3) a reversed resultant vector technique; (4) a reversed path technique; and (5) a mirror image of resultant vector technique. Associated methods of making a die based on the die profile determined above and making a metal part under a set of forming conditions from the die are also disclosed.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: March 20, 2007
    Assignee: Alcoa Inc.
    Inventors: Edmund W. Chu, Stephen J. Makosey, Jeffrey M. Shoup
  • Publication number: 20040200256
    Abstract: An improved method of forming a panel out of a workpiece, the panel being substantially free of ripples and free of ruptures, includes forming a number of smooth bulges in the workpiece in order to effectively spread a quantity of excess material that results from forming a number of desirable features into the workpiece by taking up in the bulges an amount of material. The quantity, dimensions, locations, orientations, shapes, and configurations of the bulges with respect to the features are determined by an iterative process that examines the degree to which the excess material resulting from formation of the features is effectively spread about the panel. Effective material spreading can be characterized by at least one of reduced thickening of the workpiece, reduced amplitude of ripples in the workpiece, and increased period of the ripples. An improved panel formed according to the aforementioned process is also disclosed.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 14, 2004
    Inventors: Edmund W. Chu, Jeffrey M. Shoup, Kirit N. Shah
  • Publication number: 20030182005
    Abstract: A method for determining a die profile for forming a metal part having a desired shape. The method includes the steps of providing a nominal die profile, determining a springback profile based on the nominal die profile and employing a compensation strategy to determine the die profile based on the nominal die profile and the springback profile. There are disclosed five (5) compensation strategies: (1) a reversed die-normal technique; (2) a reversed radial rotation technique; (3) a reversed resultant vector technique; (4) a reversed path technique; and (5) a mirror image of resultant vector technique. Associated methods of making a die based on the die profile determined above and making a metal part under a set of forming conditions from the die are also disclosed.
    Type: Application
    Filed: March 25, 2002
    Publication date: September 25, 2003
    Inventors: Edmund W. Chu, Stephen J. Makosey, Jeffrey M. Shoup