Patents by Inventor Edsel Gomez Balagtas

Edsel Gomez Balagtas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180261567
    Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
    Type: Application
    Filed: May 8, 2018
    Publication date: September 13, 2018
    Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
  • Publication number: 20180261568
    Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
    Type: Application
    Filed: May 11, 2018
    Publication date: September 13, 2018
    Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
  • Patent number: 9997490
    Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: June 12, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
  • Publication number: 20160276305
    Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
    Type: Application
    Filed: March 20, 2015
    Publication date: September 22, 2016
    Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas