Patents by Inventor Eduardo F. Velazquez

Eduardo F. Velazquez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11705652
    Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: July 18, 2023
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
  • Publication number: 20210044039
    Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 11, 2021
    Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
  • Patent number: 10833438
    Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: November 10, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez
  • Publication number: 20200350714
    Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 5, 2020
    Inventors: Jian Miremadi, David A. Moore, John Norton, Eduardo F. Velazquez