Abstract: An image capture device, including: a heatsink, an integrated sensor and lens assembly (ISLA), and a battery cage. The heatsink includes a mounting flange. The ISLA extends through the heatsink. The battery cage being in communication with a finger mounting flange of the mounting flange to support the battery cage within the image capture device.

Abstract: An image capture device including first and second heatsinks and a printed circuit board that separates the first and second heatsinks and includes a processor configured to generate heat. The image capture device includes a conductor assembly that is configured to transfer heat by conduction and extends between the first heatsink, the processor, and the second heatsink.

Abstract: An image capture device includes a heatsink that absorbs thermal energy and a first component that generates thermal energy. The image capture device includes a second component that generates thermal energy and a first conductor that extends between the first component and the heatsink, and the first conductor moves thermal energy from the first component to the heatsink by conduction. The image capture device includes a second conductor that extends between the second component and the heatsink, and the second conductor has a portion perpendicularly extended relative to the first conductor. The second conductor moves thermal energy from the second component to the heatsink by conduction.

Abstract: An image capture device, including: a heatsink, an integrated sensor and lens assembly (ISLA), and a battery cage. The heatsink includes a mounting flange. The ISLA extends through the heatsink. The battery cage being in communication with a finger mounting flange of the mounting flange to support the battery cage within the image capture device.

Abstract: An image capture device includes a heatsink having a cutout within the heatsink. The image capture device also includes a housing, a mounting structure located on an external side of the housing, and an integrated sensor and lens assembly (ISLA) extending through the cutout in the heatsink and connecting to the mounting structure. The ISLA is free of contact with the heatsink. The heatsink can include mounting flanges to support components including printed circuit boards and battery cages.

Abstract: An image capture device includes a heatsink that absorbs thermal energy and a first component that generates thermal energy. The image capture device includes a second component that generates thermal energy and a first conductor that extends between the first component and the heatsink, and the first conductor moves thermal energy from the first component to the heatsink by conduction. The image capture device includes a second conductor that extends between the second component and the heatsink, and the second conductor has a portion perpendicularly extended relative to the first conductor. The second conductor moves thermal energy from the second component to the heatsink by conduction.

Abstract: A passive cooling device is disclosed for use with a speaker integrated electronic device. Also disclosed is a method of using the device for generating passive cooling and increasing the sound output by the speaker integrated electronic device when outputting low frequency sound. The electronic device has an internal housing in which the speaker is located with a diaphragm extending through a void in the housing wall. The internal housing also has an air flow channel in fluid communication with the housing interior and an outlet adjacent an electronic component. Movement of the diaphragm directs moving air through the channel to reduce the operating temperature of the electronic component during speaker activation, while air movement in the internal housing increase the sound output by the speaker integrated electronic device.

Abstract: An image capture device includes a first component that is configured to provide thermal energy. A heatsink is spaced a distance apart from the first component, and a second component is positioned between the first component and the heatsink. A conductor contacts the first component and the heatsink, and the conductor extends from the first component along sides of the second component to the heatsink.

Abstract: An image capture device includes a first component that is configured to provide thermal energy. A heatsink is spaced a distance apart from the first component, and a second component is positioned between the first component and the heatsink. A conductor contacts the first component and the heatsink, and the conductor extends from the first component along sides of the second component to the heatsink.

Abstract: An image capture device includes a heatsink having a cutout within the heatsink. The image capture device also includes a housing, a mounting structure located on an external side of the housing, and an integrated sensor and lens assembly (ISLA) extending through the cutout in the heatsink and connecting to the mounting structure. The ISLA is free of contact with the heatsink. The heatsink can include mounting flanges to support components including printed circuit boards and battery cages.

Abstract: A passive cooling device is disclosed for use with a speaker integrated electronic device. Also disclosed is a method of using the device for generating passive cooling and increasing the sound output by the speaker integrated electronic device when outputting low frequency sound. The electronic device has an internal housing in which the speaker is located with a diaphragm extending through a void in the housing wall. The internal housing also has an air flow channel in fluid communication with the housing interior and an outlet adjacent an electronic component. Movement of the diaphragm directs moving air through the channel to reduce the operating temperature of the electronic component during speaker activation, while air movement in the internal housing increase the sound output by the speaker integrated electronic device.

Abstract: An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. Other embodiments may be described.

Abstract: An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. Other embodiments may be described.