Patents by Inventor Eduardo Machado
Eduardo Machado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240185156Abstract: Soil maps are rarely used for the elaboration of road layouts, and there are no known algorithms that incorporate soil information dynamically. The best way to incorporate this knowledge of soils is to interpret the soil maps into a derived (interpreted) map known as the “road, pipelines and operational locations aptitude map”. This study generated an innovative algorithm that incorporates soil aptitude maps for road layouts, pipeline lines and escape routes. The novelty of the algorithm is that this aptitude information (interpreted from a map of soil classes) is collated together with relief and hydrography information. Thus, it is hypothesized that, in addition to the characteristics of the relief and proximity of watercourses, the soil map can help the decision-maker to unveil regions with serious problems that increase the costs of construction and maintenance of roads, pipelines, escape routes and operating locations.Type: ApplicationFiled: December 1, 2023Publication date: June 6, 2024Inventors: Frederico Santos MACHADO, Wesley De Souza DA SILVA, Marcos Bacis CEDDIA, Jorge Eduardo SANTOS PAES, Andre Luis DE OLIVEIRA VILLELA
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Publication number: 20240110745Abstract: An interior layout for a refrigerator appliance features an interior liner defining a recess for a water tank, and an air tower assembly defining a space for the water tank laterally outside the air plenum of the air tower assembly. The water tank is arranged in the recess and secured to the liner with a mounting bracket. The air tower assembly includes insulation and an air tower cover. The insulation defines an opening that is dimensionally aligned with the recess and partially receives the water tank therein. The air tower cover is disposed about the insulation and conceals the water tank.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Inventors: Ricky Burgan, Marcello Machado, Eduardo Orthmann, Danilo Goncalves
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Publication number: 20220252728Abstract: A system for detecting plastics, macro-plastics, micro-plastics and nano-plastics in a maritime, estuary or river environment includes multiple detection devices and a data processing device. The detection devices detect the plastics, macro-plastics, micro-plastics, and nano-plastics using different detection wavelengths. The data processing device includes a communication interface and a processor. The communication interface receives detection signals from the detection devices and the processor determines locations of the plastics, the macro-plastics, the micro-plastics and the nano-plastics in the environment based at least in part on the received detection signals within a common coordinate system.Type: ApplicationFiled: February 9, 2021Publication date: August 11, 2022Inventors: Sverre Dokken, Jens HJELMSTAD, Alexis MICHAEL, Carlos Eduardo MACHADO DOS SANTOS PINTO, Siegfried SCHMUCK
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Patent number: 7985449Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment of the present invention, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, or mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.Type: GrantFiled: April 20, 2007Date of Patent: July 26, 2011Assignee: Air Products and Chemicals, Inc.Inventors: Diwakar Garg, Hansong Cheng, John Anthony Thomas Norman, Eduardo Machado, Pablo Ordejon
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Patent number: 7524533Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the surface of the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, and mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.Type: GrantFiled: April 9, 2004Date of Patent: April 28, 2009Assignee: Air Products and Chemicals, Inc.Inventors: Diwakar Garg, Hansong Cheng, John Anthony Thomas Norman, Eduardo Machado, Pablo Ordejon
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Publication number: 20080075855Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment of the present invention, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, or mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.Type: ApplicationFiled: November 13, 2007Publication date: March 27, 2008Applicant: AIR PRODUCTS AND CHEMICALS, INC.Inventors: Diwakar Garg, Hansong Cheng, John Norman, Eduardo Machado, Pablo Ordejon
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Patent number: 7311946Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment of the present invention, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, or mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.Type: GrantFiled: May 2, 2003Date of Patent: December 25, 2007Assignee: Air Products and Chemicals, Inc.Inventors: Diwakar Garg, Hansong Cheng, John Anthony Thomas Norman, Eduardo Machado, Pablo Ordejon
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Publication number: 20070190779Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment of the present invention, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, or mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.Type: ApplicationFiled: April 20, 2007Publication date: August 16, 2007Applicant: AIR PRODUCTS AND CHEMICALS, INC.Inventors: Diwakar Garg, Hansong Cheng, John Norman, Eduardo Machado, Pablo Ordejon
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Publication number: 20040234704Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the surface of the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, and mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.Type: ApplicationFiled: April 9, 2004Publication date: November 25, 2004Inventors: Diwakar Garg, Hansong Cheng, John Anthony Thomas Norman, Eduardo Machado, Pablo Ordejon
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Publication number: 20040219369Abstract: A process is described for depositing a metal film on a substrate surface having a diffusion barrier layer deposited thereupon. In one embodiment of the present invention, the process includes: providing a surface of the diffusion barrier layer that is substantially free of an elemental metal and forming the metal film on at least a portion of the surface via deposition by using a organometallic precursor. In certain embodiments, the diffusion barrier layer may be exposed to an adhesion promoting agent prior to or during at least a portion of the forming step. Suitable adhesion promoting agents include nitrogen, nitrogen-containing compounds, carbon-containing compounds, carbon and nitrogen containing compounds, silicon-containing compounds, silicon and carbon containing compounds, silicon, carbon, and nitrogen containing compounds, or mixtures thereof. The process of the present invention provides substrates having enhanced adhesion between the diffusion barrier layer and the metal film.Type: ApplicationFiled: May 2, 2003Publication date: November 4, 2004Inventors: Diwakar Garg, Hansong Cheng, John Anthony Thomas Norman, Eduardo Machado, Pablo Ordejon