Abstract: A package for an integrated circuit chip adapted to operate at microwave frequencies. The package includes an electrically conductive lead frame having electrical leads extending outwardly from an inner region. A base section is adhesively affixed to a bottom portion of the lead frame. The base section and a plastic cover are configured to provide a cavity when the cover and the base section are affixed with the integrated circuit chip being disposed with such provided cavity. With another integrated circuit chip package, an electrically conductive lead frame has electrical leads adapted for electrical connection to the integrated circuit chip. The base section includes a conductive member nd a dielectric member. The dielectric member has an aperture disposed in registration with an inner region of the lead frame. The conductive member is electrically to a bottom surface portion of the integrated circuit. The integrated circuit chip being disposed in registration with the aperture.

Abstract: A package for an integrated circuit chip adapted to operate at microwave frequencies. The package includes an electrically conductive lead frame having electrical leads extending outwardly from an inner region. A base section is adhesively affixed to a bottom portion of the lead frame. The base section and a plastic cover are configured to provide a cavity when the cover and the base section are affixed with the integrated circuit chip being disposed with such provided cavity. With another integrated circuit chip package, an electrically conductive lead frame has electrical leads adapted for electrical connection to the integrated circuit chip. The base section includes a conductive member nd a dielectric member. The dielectric member has an aperture disposed in registration with an inner region of the lead frame. The conductive member is electrically to a bottom surface portion of the integrated circuit. The integrated circuit chip being disposed in registration with the aperture.

Abstract: For fine line lithography of a reflective substrate, a layer of titanium nitride is applied between the reflective surface and the photoresist that is absorbant at the wavelength of light used to expose the photoresist. The resolution of the photoresist is improved, even when an absorbant dye is used in the photoresist. The titanium nitride can be readily removed at the same time as the reflective layer is patterned, thereby avoiding the need of a separate step to remove the absober layer during etching of the reflective substrate.

Abstract: An ion implanter apparatus is described with provision for neutralizing the space charge potential of the ionic beam with a closed loop feedback system responding to the electrical charges that tend to accumulate on a target specimen. Neutralization is provided by a controllable electron source surrounding the beam. Flow of electrons to a plate radially outward of the electron source is used to derive a signal proportional to the beam ion current when the space charge potential of the beam is neutralized. The beam current signal can be used (1) to provide a read-out display for the operator; (2) to control the magnitude of the ion beam; (3) to be integrated to determine the total positive charge that enters the Faraday cage of the implanter for use to control the ion beam shutter; or (4) to effect relative movement of the specimen and the beam.