Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow.

Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow.

Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow.

Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow.

Abstract: An apparatus for securing an object to a surface comprises a mounting cover having a first surface and a pair of sidewalls depending away from the first surface. The sidewalls are in a facing spaced relationship and secured to a second surface. At least two securement members are secured to the first surface between the pair of sidewalls. The securement members are configured to define a receiving area. Each securement member has a pair of engagement members secured within at least a pair of openings in the first surface. Each pair of engagement members include an upper surface. The upper surfaces of the pairs of engagement members are flush with respect to the first surface. An actuating member having a first portion, and a second portion depending away from said first portion, is configured to be slidably engaged in the receiving area. The second portion has a pair of engagement openings for slidably receiving a pair of guide members mounted to the object.

Abstract: An apparatus for securing an object to a surface comprises a mounting cover having a first surface and a pair of sidewalls depending away from the first surface. The sidewalls are in a facing spaced relationship and secured to a second surface. At least two securement members are secured to the first surface between the pair of sidewalls. The securement members are configured to define a receiving area. Each securement member has a pair of engagement members secured within at least a pair of openings in the first surface. Each pair of engagement members include an upper surface. The upper surfaces of the pairs of engagement members are flush with respect to the first surface. An actuating member having a first portion, and a second portion depending away from said first portion, is configured to be slidably engaged in the receiving area. The second portion has a pair of engagement openings for slidably receiving a pair of guide members mounted to the object.

Abstract: An exemplary embodiment of the present invention is a method for fastening an object flush to a surface. The method comprises inserting an engagement member of the object into an opening in the planar member. The engagement member moves in a first direction and remains at or below the surface of the planar member. The engagement member of the object is repositioned in the opening while moving in a second direction. An engaging force is then applied to the engagement member in a third direction. The engaging force causes the engagement member of the object to be secured within the opening flush or below the surface of the planar member.