Patents by Inventor Edward Gerald Marvin

Edward Gerald Marvin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8591257
    Abstract: An electrical wafer for electrically connecting to a printed circuit board. The electrical wafer includes an insulative housing and at least one signal conductor disposed in the insulative housing. The at least one signal conductor includes an intermediate portion having a connection point. The connection point includes first and second ends, at least one of which has a width greater than a portion of the at least one signal conductor outside the connection point. The insulative housing has at least one aperture exposing at least a portion of the connection point. A portion of the connection point may be punched out, and a passive circuit element may be placed within the at least one aperture and mounted to the connection point. Multiple electrical wafers may be coupled together by a stiffener and connected to a backplane connector.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: November 26, 2013
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Mark W. Gailus, Jerry Proulx, Edward Gerald Marvin
  • Publication number: 20130130554
    Abstract: An electrical wafer for electrically connecting to a printed circuit board. The electrical wafer includes an insulative housing and at least one signal conductor disposed in the insulative housing. The at least one signal conductor includes an intermediate portion having a connection point. The connection point includes first and second ends, at least one of which has a width greater than a portion of the at least one signal conductor outside the connection point. The insulative housing has at least one aperture exposing at least a portion of the connection point. A portion of the connection point may be punched out, and a passive circuit element may be placed within the at least one aperture and mounted to the connection point. Multiple electrical wafers may be coupled together by a stiffener and connected to a backplane connector.
    Type: Application
    Filed: November 17, 2011
    Publication date: May 23, 2013
    Inventors: Donald A. Girard, Mark W. Gailus, Jerry Proulx, Edward Gerald Marvin
  • Patent number: 6537087
    Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: March 25, 2003
    Assignee: Teradyne, Inc.
    Inventors: David M. McNamara, Edward Gerald Marvin
  • Patent number: 6530790
    Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: March 11, 2003
    Assignee: Teradyne, Inc.
    Inventors: David M. McNamara, Sepehr Kiani, William E. Howard, Philip Stokoe, Edward Gerald Marvin
  • Publication number: 20020098727
    Abstract: An electrical connector having a plurality of electrical conductors with one portion thereof disposed in a housing and an end of such connector projecting outward from the housing and terminating in a pad disposed perpendicular to the housing disposed portion. The connector is provided adapted for mounting to an ball grid array disposed on a printed circuit board. The pad is coupled to the conductor through a curved interconnect. The interconnect is configured as an inductor to provide a series resonant circuit element for the capacitor effect provided by the pad. The connector has a housing adapted to having therein a plurality of wafer-like modules. Each one of the modules has a dielectric support and an array of signal electrical conductors electrically insulated by portions of the supports. A ground plane electrical conductor is provided. The ground plane conductor is disposed under, and is separated from, portions of the signal electrical conductor by the dielectric member.
    Type: Application
    Filed: January 25, 2002
    Publication date: July 25, 2002
    Applicant: Teradyne, Inc.
    Inventors: David M. McNamara, Sepehr Kiani, William E. Howard, Philip Stokoe, Edward Gerald Marvin