Abstract: A phased array antenna includes an antenna housing having a subarray assembly that supports beam forming network modules and an array face defining a ground plane substantially orthogonal to the subarray assembly. A plurality of millimeter wavelength patch antenna elements are positioned on the array face and each positioned adjacent a respective subarray assembly. The millimeter wavelength patch antenna elements each include a driven antenna element having a front and rear side and a parasitic antenna element positioned forward of the front side of the driven antenna element. A microstrip quadrature-to-circular polarization circuit is positioned rearward of the rear side of the driven antenna element and operatively connected to the driven antenna element. A single millimeter wavelength feed operatively connects the microstrip quadrature-to-circular polarization circuit with a respective adjacent beam forming network module supported on the orthogonal positioned subarray assembly.

Abstract: A package for a microwave circuit chip and associated microstrip antenna is formed of a multi-layer ceramic laminate within which is supported a microwave chip carrier and on an outer surface of which a microstrip antenna disposed. A first ceramic layer is supported on metallic base member and contains signal lines for interfacing the chip with the external world. Disposed atop the first ceramic layer is a second ceramic layer which forms a protective seal ring around the perimeter of the chip. A third ceramic cover layer is mounted atop the seal ring layer and contains one or more antenna elements on its outer surface. Signal line connections between the chip and the antenna elements are effected through tuned networks that extend from signal leads on the chip to conductors on the first ceramic layer. Signal connections from the first ceramic layer to the antenna on the cover may be formed by conductive vias through the ceramic seal ring layer or conductors along sidewalls of the seal ring layer and cover.

Abstract: A miniaturized transmission link architecture for intercoupling high frequency miniaturized integrated circuit components comprises a thin conductive plate in one surface of which a matrix or grid work of rectilinear grooves or channels are formed, creating "waffle-iron"-like pattern in one surface of the conductive plate. The spacing between channels corresponds to the width of a channel which, in turn, may be sized to substantially match the outer diameter of insulation jacketed wire that is placed in the channels. The depth of a channel or groove is slightly larger than the outer diameter of the wire to accommodate wire crossovers at intersections of the channels. The top surface of the "waffle-plate" is provided with a conductive foil to complete the shielding for the wires.

Abstract: A miniaturized transmission link architecture for intercoupling high frequency miniaturized integrated circuit components comprises a thin conductive plate in one surface of which a matrix or grid work of rectilinear grooves or channels are formed, creating "waffle-iron"-like pattern in one surface of the conductive plate. The spacing between channels corresponds to the width of a channel which, in turn, may be sized to substantially match the outer diameter of insulation jacketed wire that is placed in the channels. The depth of a channel or groove is slightly larger than the outer diameter of the wire to accommodate wire crossovers at intersections of the channels. The top surface of the "waffle-plate" is provided with a conductive foil to complete the shielding for the wires.