Abstract: A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.

Abstract: The present invention proposes an apparatus or jig for the controlled spot heating of a substrate having soldered components therein and a designated locus to be heated for removal and/or replacement of a component. The apparatus comprises a frame and support means on the frame for holding and positioning the substrate with the locus to be heated along a designated axis of the frame. A rail at one end of the frame parallel to the designated axis holds a heating arm. The heating arm extends along an axis perpendicular to the designated axis and can be positioned along the rail. The heating arm ends in a directing means that is positioned over the designated axis and directs a heating medium, e.g. infra red radiation or a heated gas, onto a locus to be heated. The directing means limits the area of the application of the heating medium to only that area necessary for removal of the component.

Abstract: A nonfocused infrared panel emitter and method of making the same. The panel emitter includes a primary emitter positioned between an insulating layer and a secondary emitter. Preferably, the primary emitter comprises a metal foil having a pattern formed by etching. The secondary emitter may be either a woven alumina cloth, or a sheet of glass which is transparent to infrared radiation. In one embodiment of the invention, a layer of somewhat compressible, high temperature resistant paper is placed on either side of the metal foil to accommodate expansion and contraction thereof. In one method of making the panel emitter, a mesh sheet is positioned adjacent the metal foil and the sheet is vaporized by heating to create a void adjacent the foil to allow for thermal expansion and contraction of the foil.

Abstract: A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.

Abstract: A nonfocused infrared panel emitter and method of making the same. The panel emitter includes a primary emitter positioned between an insulating layer and a secondary emitter. Preferably, the panel emitter comprises a metal foil primary emitter, woven alumina cloth secondary emitter, and alumina silica board insulating layer bonded together by means of an alumina silica binder. In the method of making the panel emitter, a mesh sheet is preferably positioned adjacent the foil and the sheet is vaporized by heating prior to bonding to create a void adjacent the foil to allow thermal expansion and contraction of the foil.

Abstract: A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.