Patents by Inventor Edward J. Yarmchuk
Edward J. Yarmchuk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11224927Abstract: Exemplary embodiments of the invention include a method and apparatus for assembling a semiconductor device. The method may include heating the semiconductor device, which comprises a printed circuit card and a packaging laminate, according to a device heating profile to melt solder material located between an array of contact points on the printed circuit card and an array of corresponding contact points on the packaging laminate; and cooling the semiconductor device to solidify the solder material, wherein during at least a portion of the cooling a temperature of the printed circuit card is kept at substantially a same temperature or a higher temperature than a temperature of an electronic module attached to the packaging laminate opposite the corresponding array of contact points.Type: GrantFiled: November 25, 2015Date of Patent: January 18, 2022Assignee: International Business Machines CorporationInventors: Michael Gaynes, Edward J Yarmchuk
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Patent number: 10908110Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.Type: GrantFiled: July 1, 2019Date of Patent: February 2, 2021Assignee: International Business Machines CorporationInventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
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Publication number: 20190323983Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.Type: ApplicationFiled: July 1, 2019Publication date: October 24, 2019Inventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
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Patent number: 10338024Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.Type: GrantFiled: July 8, 2017Date of Patent: July 2, 2019Assignee: International Business Machines CorporationInventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
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Patent number: 10141236Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: GrantFiled: July 20, 2017Date of Patent: November 27, 2018Assignee: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
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Patent number: 10043725Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: GrantFiled: July 20, 2017Date of Patent: August 7, 2018Assignee: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
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Publication number: 20180090406Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: ApplicationFiled: July 20, 2017Publication date: March 29, 2018Applicant: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
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Publication number: 20180090407Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: ApplicationFiled: July 20, 2017Publication date: March 29, 2018Applicant: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Gaynes, Edward J. Yarmchuk
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Publication number: 20170307558Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.Type: ApplicationFiled: July 8, 2017Publication date: October 26, 2017Inventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
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Patent number: 9786572Abstract: A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4).Type: GrantFiled: September 23, 2016Date of Patent: October 10, 2017Assignee: International Business Machines CorporationInventors: Martin Beaumier, Yves Dallaire, Melania C. Doll, Michael Michael Gaynes, Edward J. Yarmchuk
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Patent number: 9714911Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes.Type: GrantFiled: November 18, 2013Date of Patent: July 25, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
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Publication number: 20170148758Abstract: Exemplary embodiments of the invention include a method and apparatus for assembling a semiconductor device. The method may include heating the semiconductor device, which comprises a printed circuit card and a packaging laminate, according to a device heating profile to melt solder material located between an array of contact points on the printed circuit card and an array of corresponding contact points on the packaging laminate; and cooling the semiconductor device to solidify the solder material, wherein during at least a portion of the cooling a temperature of the printed circuit card is kept at substantially a same temperature or a higher temperature than a temperature of an electronic module attached to the packaging laminate opposite the corresponding array of contact points.Type: ApplicationFiled: November 25, 2015Publication date: May 25, 2017Inventors: Michael Gaynes, Edward J. Yarmchuk
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Patent number: 8877566Abstract: A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.Type: GrantFiled: August 15, 2012Date of Patent: November 4, 2014Assignee: International Business Machines CorporationInventors: Michael A. Gaynes, Maurice McGlashan-Powell, Soojae Park, Edward J. Yarmchuk
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Publication number: 20140070822Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes.Type: ApplicationFiled: November 18, 2013Publication date: March 13, 2014Applicant: International Business Machines CorporationInventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
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Patent number: 8589102Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes.Type: GrantFiled: January 21, 2011Date of Patent: November 19, 2013Assignee: International Business Machines CorporationInventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
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Publication number: 20120053874Abstract: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes.Type: ApplicationFiled: January 21, 2011Publication date: March 1, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Timothy J. Chainer, Michael A. Gaynes, Edward J. Yarmchuk
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Patent number: 8026730Abstract: A process for measuring the thickness of an insulating material. The process includes providing a device used to measure capacitance, and electrically connecting the capacitance measuring device to a heat sink and an electrical, heat-generating component. The thickness of the insulating material is determined by measuring the capacitance of the insulating material according to tile formula: B=?r?oA/C, where B is the thickness of the insulating material, C is tile capacitance, A is the area of tile heat generating component, ?o is the permittivity of free space and ?r is the relative dielectric constant of the insulating material.Type: GrantFiled: July 26, 2010Date of Patent: September 27, 2011Assignee: International Business Machines CorporationInventors: Michael A. Gaynes, Edward J. Yarmchuk
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Publication number: 20100289504Abstract: A process for measuring the thickness of an insulating material. The process includes providing a device used to measure capacitance, and electrically connecting the capacitance measuring device to a heat sink and an electrical, heat-generating component. The thickness of the insulating material is determined by measuring the capacitance of the insulating material according to the formula; B=?r?oA/C, where B is the thickness of the insulating material, C is the capacitance, A is the area of the heat generating component, ?o is the permittivity of free space and ?r is the relative dielectric constant of the insulating material.Type: ApplicationFiled: July 26, 2010Publication date: November 18, 2010Applicant: International Business Machines CorporationInventors: Michael A. Gaynes, Edward J. Yarmchuk
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Patent number: 7808257Abstract: A method and apparatus for the non-contact electrical test of both opens and shorts in electronic substrates. Top surface electrical test features are exposed to an ionization source under ambient conditions and the subsequent charge build up is measured as a drain current by probes contacting corresponding bottom surface features. Opens are detected by an absence of a drain current and shorts are detected by turning off the ionization source and re-measuring the bottom surface probes with a varying bias applied to each probe in the array.Type: GrantFiled: November 12, 2003Date of Patent: October 5, 2010Assignee: International Business Machines CorporationInventors: Christopher W. Cline, Edward J. Yarmchuk, Vincent A. Arena, Donald A. Merte, Thomas Picunko, Brian J. Wojszynski, Charles J. Hendricks, Michael E. Scaman, Robert S. Olyha, Jr., Arnold Halperin
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Patent number: 7764069Abstract: A process for measuring the thickness of an insulating material. The process includes providing a device used to measure capacitance, and electrically connecting the capacitance measuring device to a heat sink and an electrical, heat-generating component. The thickness of the insulating material is determined by measuring the capacitance of the insulating material according to the formula; B=?r?oA/C, where B is the thickness of the insulating material, C is the capacitance, A is the area of the heat generating component, ?o is the permittivity of free space and ?r is the relative dielectric constant of the insulating material.Type: GrantFiled: April 25, 2007Date of Patent: July 27, 2010Assignee: International Business Machines CorporationInventors: Michael A. Gaynes, Edward J. Yarmchuk