Abstract: According to one aspect of the disclosure, a planar substrate receives a plurality of conductive posts therein, which posts include an offset medial portion having a laterally projecting notch portion. Certain posts are arranged with their notch portions in coplanar relationship and in latching registration with an interior sidewall portion of a housing received over the posts. Accordingly, the housing provides an insulating receptacle shroud for the posts and is latchingly retained in place without a need for attachment to the substrate. The shroud is also provided with card guides connected thereto by integral hinge portions enabling alignment of, and reducing twisting and warping of, the card guides. The card guides are additionally coupled together with rails further reducing twisting and warping of the guides. The terminals are advantageously mounted in strip form for ease in manufacture and assembly to the substrate.

Abstract: A method of connecting the terminal posts of a connector into holes in a circuit board comprising the steps of inserting solder elements, which can have the shape of a doughnut or torus, for example, around each terminal post; inserting a piece of material, such as a strip of plastic or a Styrofoam material rod having a width or diameter greater than the distance between the two rows of terminal posts, in between said two rows of terminal posts to hold the solder elements on the posts; inserting the terminal posts in the holes prepared therefor in the circuit board; removing the strip or rod of material; further inserting, if necessary, the terminal posts into the circuit board holes; and heating the solder doughnuts by appropriate means while the terminal posts are pointed downwardly, that is with the circuit board below the connector, to reflow the solder into the spaces between the holes in the circuit board and the terminal posts therein.