Patents by Inventor Edward Martin Godshalk
Edward Martin Godshalk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955420Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: GrantFiled: February 27, 2023Date of Patent: April 9, 2024Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
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Publication number: 20240021337Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.Type: ApplicationFiled: December 10, 2021Publication date: January 18, 2024Inventors: Jesse Michael Martinez, Micheal Adventure Hopkins, Charles J. Kinzel, Trevor Antonio Rivera, Mark William Ronay, Edward Martin Godshalk
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Publication number: 20230317314Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.Type: ApplicationFiled: June 8, 2023Publication date: October 5, 2023Inventors: Jesse Michael Martinez, Michael Adventure Hopkins, Charles J. Kinzel, Trevor Antonio Rivera, Mark William Ronay, Edward Martin Godshalk
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Publication number: 20230290717Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: ApplicationFiled: February 27, 2023Publication date: September 14, 2023Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
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Publication number: 20230258510Abstract: A flexible inductive pressure sensor, system, and method include an inductor configured to deform in multiple dimensions while maintaining inductive properties. A conductor is spaced apart from the inductor by a spacer positioned between the inductor and the conductor. The inductor has an inductance that varies based on an instantaneous distance between the inductor and the conductor. A capacitor is electrically coupled to the inductor and having a capacitance, wherein the inductor and the capacitor form a resonant circuit based on the inductance of the inductor and the capacitance of the capacitor. The resonant circuit is configured to, upon an input electrical signal applied to the flexible inductive pressure sensor, vary a voltage amplitude of an output signal based on the force applied to one or both of the inductor and the conductor and a resultant change in the impedance of the inductor.Type: ApplicationFiled: September 3, 2021Publication date: August 17, 2023Applicant: Liquid Wire, LLCInventors: Edward Martin GODSHALK, Trevor Antonio RIVERA, Michael Adventure HOPKINS
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Patent number: 11594480Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: GrantFiled: August 5, 2021Date of Patent: February 28, 2023Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
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Publication number: 20220270961Abstract: A method includes stacking a first layer of insulating material having one or more passages on a substrate. A deformable conductive material is deposited in at least one of the passages in the first insulating layer. A second layer of insulating material is stacked on the first layer of insulating material.Type: ApplicationFiled: February 18, 2022Publication date: August 25, 2022Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
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Publication number: 20220068787Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: ApplicationFiled: August 5, 2021Publication date: March 3, 2022Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
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Patent number: 11088063Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.Type: GrantFiled: August 22, 2019Date of Patent: August 10, 2021Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Trevor Antonio Rivera, Michael Adventure Hopkins, Edward Martin Godshalk, Charles J. Kinzel
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Patent number: 8952768Abstract: A bulk acoustic wave (BAW) resonator is constructed to reduce phase and amplitude ripples in a frequency response. The BAW resonator is fabricated on a substrate 400 ?m thick or less, preferably approximately 325 ?m, having a first side and a polished second side with a peak-to-peak roughness of approximately 1000 A. A Bragg mirror having alternate layers of a high acoustic impedance material, such as tungsten, and a low acoustic impedance material is fabricated on the first side of the substrate. A BAW resonator is fabricated on the Bragg mirror. A lossy material, such as epoxy, coats the second side of the substrate opposite the first side. The lossy material has an acoustic impedance in the range of 0.01× to 1.0× the acoustic impedance of the layers of high acoustic impedance material.Type: GrantFiled: August 20, 2013Date of Patent: February 10, 2015Assignee: Triquint Semiconductor, Inc.Inventors: Edward Martin Godshalk, Rick D. Lutz, Masud Hannan, Ralph N. Wall, Uppili Sridhar
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Patent number: 8847365Abstract: Inductors and methods for integrated circuits that result in inductors of a size compatible with integrated circuits, allowing the fabrication of inductors, with or without additional circuitry on a first wafer and the bonding of that wafer to a second wafer without wasting of wafer area. The inductors in the first wafer are comprised of coils formed by conductors at each surface of the first wafer coupled to conductors in holes passing through the first wafer. Various embodiments are disclosed.Type: GrantFiled: November 14, 2012Date of Patent: September 30, 2014Assignee: Maxim Integrated Products, Inc.Inventors: Joseph P. Ellul, Khanh Tran, Edward Martin Godshalk, Albert Bergemont
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Publication number: 20130335169Abstract: A bulk acoustic wave (BAW) resonator is constructed to reduce phase and amplitude ripples in a frequency response. The BAW resonator is fabricated on a substrate 400 ?m thick or less, preferably approximately 325 ?m, having a first side and a polished second side with a peak-to-peak roughness of approximately 1000 A. A Bragg mirror having alternate layers of a high acoustic impedance material, such as tungsten, and a low acoustic impedance material is fabricated on the first side of the substrate. A BAW resonator is fabricated on the Bragg mirror. A lossy material, such as epoxy, coats the second side of the substrate opposite the first side. The lossy material has an acoustic impedance in the range of 0.01× to 1.0× the acoustic impedance of the layers of high acoustic impedance material.Type: ApplicationFiled: August 20, 2013Publication date: December 19, 2013Applicant: TriQuint Semiconductor, Inc.Inventors: Edward Martin Godshalk, Rick D. Lutz, Masud Hannan, Ralph N. Wall, Uppili Sridhar
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Patent number: 8512800Abstract: Methods of reducing phase and amplitude ripples in a BAW resonator frequency response by providing a substrate, fabricating a Bragg mirror having alternate layers of a high acoustic material and a low acoustic material on a first surface of the substrate, fabricating a BAW on the Bragg mirror, and coating a second side of the substrate opposite the first side with a lossy material having an acoustic impedance in the range of 0.01× to 1.0× the acoustic impedance of the layers of high impedance material, the second surface of the substrate being a polished surface. Various embodiments are disclosed.Type: GrantFiled: December 4, 2007Date of Patent: August 20, 2013Assignee: Triquint Semiconductor, Inc.Inventors: Edward Martin Godshalk, Rick D. Lutz, Masud Hannan, Ralph N. Wall, Uppili Sridhar
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Publication number: 20130071983Abstract: Inductors and methods for integrated circuits that result in inductors of a size compatible with integrated circuits, allowing the fabrication of inductors, with or without additional circuitry on a first wafer and the bonding of that wafer to a second wafer without wasting of wafer area. The inductors in the first wafer are comprised of coils formed by conductors at each surface of the first wafer coupled to conductors in holes passing through the first wafer. Various embodiments are disclosed.Type: ApplicationFiled: November 14, 2012Publication date: March 21, 2013Inventors: Joseph P. Ellul, Khanh Tran, Edward Martin Godshalk, Albert Bergemont
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Patent number: 8344478Abstract: Inductors and methods for integrated circuits that result in inductors of a size compatible with integrated circuits, allowing the fabrication of inductors, with or without additional circuitry on a first wafer and the bonding of that wafer to a second wafer without wasting of wafer area. The inductors in the first wafer are comprised of coils formed by conductors at each surface of the first wafer coupled to conductors in holes passing through the first wafer. Various embodiments are disclosed.Type: GrantFiled: October 23, 2009Date of Patent: January 1, 2013Assignee: Maxim Integrated Products, Inc.Inventors: Joseph P. Ellul, Khanh Tran, Edward Martin Godshalk, Albert Bergemont
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Publication number: 20110095395Abstract: Inductors and methods for integrated circuits that result in inductors of a size compatible with integrated circuits, allowing the fabrication of inductors, with or without additional circuitry on a first wafer and the bonding of that wafer to a second wafer without wasting of wafer area. The inductors in the first wafer are comprised of coils formed by conductors at each surface of the first wafer coupled to conductors in holes passing through the first wafer. Various embodiments are disclosed.Type: ApplicationFiled: October 23, 2009Publication date: April 28, 2011Applicant: MAXIM INTEGRATED PRODUCTS, INC.Inventors: Joseph P. Ellul, Khanh Tran, Edward Martin Godshalk, Albert Bergemont
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Patent number: 7567024Abstract: Methods of contacting the top layer in a BAW device by depositing a metal layer over the BAW device, patterning the metal layer so that the metal layer extends over and contacts the top electrode layer of the BAW device only at a plurality of spaced apart locations adjacent the periphery of the active resonator area, and has a common region laterally displaced from the top and bottom electrodes and electrically interconnecting the parts of the metal layer extending over and contacting the top electrode of the BAW device at the plurality of spaced apart locations.Type: GrantFiled: September 26, 2007Date of Patent: July 28, 2009Assignee: Maxim Integrated Products, Inc.Inventors: Ralph N. Wall, Guillaume Bouche, Edward Martin Godshalk, Rick D. Lutz, Garth Sundberg
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Publication number: 20090142480Abstract: Methods of reducing phase and amplitude ripples in a BAW resonator frequency response by providing a substrate, fabricating a Bragg mirror having alternate layers of a high acoustic material and a low acoustic material on a first surface of the substrate, fabricating a BAW on the Bragg mirror, and coating a second side of the substrate opposite the first side with a lossy material having an acoustic impedance in the range of 0.01x to 1.0x the acoustic impedance of the layers of high impedance material, the second surface of the substrate being a polished surface. Various embodiments are disclosed.Type: ApplicationFiled: December 4, 2007Publication date: June 4, 2009Applicant: MAXIM INTEGRATED PRODUCTS, INC.Inventors: Edward Martin Godshalk, Rick D. Lutz, Masud Hannan, Ralph N. Wall, Uppili Sridhar
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Publication number: 20090079302Abstract: Methods of contacting the top layer in a BAW device by depositing a metal layer over the BAW device, patterning the metal layer so that the metal layer extends over and contacts the top electrode layer of the BAW device only at a plurality of spaced apart locations adjacent the periphery of the active resonator area, and has a common region laterally displaced from the top and bottom electrodes and electrically interconnecting the parts of the metal layer extending over and contacting the top electrode of the BAW device at the plurality of spaced apart locations.Type: ApplicationFiled: September 26, 2007Publication date: March 26, 2009Applicant: Maxim Integrated Products, Inc.Inventors: Ralph N. Wall, Guillaume Bouche, Edward Martin Godshalk, Rick D. Lutz, Garth Sundberg