Abstract: The antenna of an RFID device is formed by applying an adhesive to a substrate. A conductor is secured to the substrate using the adhesive and then a gap is defined in the conductor in the shape of an antenna so as to isolate an inner region of the conductor from an outer region of the conductor. Heat is applied to the outer region of the conductor so as to cause at least a portion of the adhesive positioned between the outer region of the conductor and the substrate to undergo a phase change or be activated without causing at least a portion of the adhesive positioned between the inner region of the conductor and the substrate to undergo a phase change or be activated. The outer region of the conductor is then dissociated from the substrate, with the inner region of the conductor remaining secured to the substrate by the adhesive as an antenna.

Abstract: Systems and methods are provided for transferring a remote frequency identification (RFID) inlay from a first substrate to a second substrate. An RFID inlay is secured to a first substrate with a first adhesive. The RFID inlay is brought into the vicinity of a second substrate and secured to the second substrate with a second adhesive. The RFID inlay is then dissociated from the first substrate. The RFID inlay may be dissociated from the first substrate by softening the first adhesive, such as by the application of heat or the application of a softening substance. Alternatively, the RFID inlay may be dissociated from the first substrate without softening the first adhesive, but rather by differential release, whereby a release force is applied between the two substrates, with the release force being greater than the release strength of the first adhesive, but less than the release strength of the second adhesive.

Abstract: An RFID device includes an antenna defining a gap, with an RFID strap electrically coupled to the antenna across the gap. The RFID strap is secured to the antenna by a self-adhesive substance, such as a pressure-sensitive adhesive, an isotropic conductive adhesive, or an anisotropic conductive adhesive. The use of a self-adhesive substance allows for such an RFID device to be assembled at facilities other than dedicated RFID device manufacturing facilities, which may include a packaging supplier factory. Additionally, such an RFID device allows for the creation of a flexible “build on demand” system capable of producing a smaller number of RFID devices than are typically produced using conventional approaches. Such a system may further test, program, apply print to, and/or cut an RFID device that it has assembled.

Abstract: A method for manufacturing an antenna for an RFID device includes providing a conductive material on a substrate and performing a first cutting process on the conductive material to define an initial antenna. Additional cutting processes are performed on the initial antenna to define a final antenna, with the first and any subsequent cutting processes being different. The subsequent cutting processes are capable of more finely defining regions of the antenna, such as in some embodiments when the first cutting process is a die cutting process and a second cutting process is a laser cutting process. While the subsequent cutting processes are capable of more finely defining regions of the antenna than the first cutting process. By combining multiple cutting processes, a final antenna equivalent to one made using only one or more of the subsequent cutting processes may be created at a lower cost.

Abstract: The antenna of an RFID device is formed by applying an adhesive to a substrate. A conductor is secured to the substrate using the adhesive and then a gap is defined in the conductor in the shape of an antenna so as to isolate an inner region of the conductor from an outer region of the conductor. Heat is applied to the outer region of the conductor so as to cause at least a portion of the adhesive positioned between the outer region of the conductor and the substrate to undergo a phase change or be activated without causing at least a portion of the adhesive positioned between the inner region of the conductor and the substrate to undergo a phase change or be activated. The outer region of the conductor is then dissociated from the substrate, with the inner region of the conductor remaining secured to the substrate by the adhesive as an antenna.