Abstract: Embodiments are directed to decomposing an all-to-all interconnection network topology into a plurality of smaller all-to-all interconnection network elements, replicating the interconnection network elements in a modular fashion, wherein the modular interconnection network elements construct the all-to-all interconnection network topology. Embodiments are directed to an apparatus comprising a shuffle cable assembly comprising a plurality of shuffle cables, where each of the plurality of shuffle cables comprises a plurality of optical fibers and a plurality of connectors, a block configured to organize, align, and maintain a position of the plurality of connectors, and at least one handle coupled to the block and configured to actuate the plurality of connectors.

Abstract: Embodiments are directed to decomposing an all-to-all interconnection network topology into a plurality of smaller all-to-all interconnection network elements, replicating the interconnection network elements in a modular fashion, wherein the modular interconnection network elements construct the all-to-all interconnection network topology. Embodiments are directed to an apparatus comprising a shuffle cable assembly comprising a plurality of shuffle cables, where each of the plurality of shuffle cables comprises a plurality of optical fibers and a plurality of connectors, a block configured to organize, align, and maintain a position of the plurality of connectors, and at least one handle coupled to the block and configured to actuate the plurality of connectors.

Abstract: Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.

Abstract: Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.

Abstract: A method and related apparatus for servicing an electrical/electronic device during power shut offs is provided. The apparatus comprises a service logic having a memory and control component for storing device information during normal device operation and one or more indicators driven by the memory and control component after power shut off to provide service signals. The service logic also includes an auxiliary energy source selectively engageable to provide auxiliary power to the memory and control component during power shut off and to enable providing of service signals through the indicator(s).

Abstract: A docking apparatus for printed circuit boards including a cassette housing so as to define a housing cavity for containing a printed circuit board (PCB) and a linkage mechanism disposed so as to be associated with the cassette housing. The linkage mechanism includes a linkage arm pivotally connected to the cassette housing via a pivot and has a first arm pivotally connected to the PCB, a clevis pivotally connected to a second arm extending from the first arm, a shaft extending through an aperture in the clevis at a first end defining the shaft, the first end configured to operably transfer axial translation of the shaft to the clevis, and an opposite second end defining the shaft includes a thread, and a nut operably secured to the cassette housing.