Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

Abstract: Systems and methods are provided for reducing unwanted noise in an electronic audio signal, wherein a computing device having a microphone is configured to receive signals from a sensor on an external device such as a camera, second microphone, or movement sensor. The signals from the sensor are used to identify sound information or characteristics of sounds made by a source of noise, and the audio signal of the microphone is modified to reduce unwanted sounds based on that sound information or based on sounds identified a second audio signal obtained by the second microphone, thereby improving teleconference and video conference audio quality and removing distracting noises from transmitted audio output.

Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

Abstract: Systems and methods are provided for reducing unwanted noise in an electronic audio signal, wherein a computing device having a microphone is configured to receive signals from a sensor on an external device such as a camera, second microphone, or movement sensor. The signals from the sensor are used to identify sound information or characteristics of sounds made by a source of noise, and the audio signal of the microphone is modified to reduce unwanted sounds based on that sound information or based on sounds identified a second audio signal obtained by the second microphone, thereby improving teleconference and video conference audio quality and removing distracting noises from transmitted audio output.

Abstract: A impact detection system can include an earbud having a first motion sensor and a wearable electronic device in electrical communication with the earbud and comprising a second motion sensor electrically connected to a processor. The processor can determine if a threshold event has occurred based on a first motion detected by the first motion sensor and a second motion detected by the second motion sensor.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

Abstract: Embodiments disclosed are directed to a woven fabric band that is capable of being secured to another object using threads or the band itself. The woven fabric band may include an inner layer having a first temperature melting point and an outer layer having a second temperature melting point that is higher than the first temperature melting point. When heat having the first temperature is applied to the woven fabric band, the inner layer of the woven fabric band melts while the outer layer remains in its original state. When the inner layer melts, the inner layer conforms to a first shape. As a result of the inner layer conforming to the first shape, the outer layer also conforms to the same shape.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.

Abstract: Systems and methods are provided for reducing unwanted noise in an electronic audio signal, wherein a computing device having a microphone is configured to receive signals from a sensor on an external device such as a camera, second microphone, or movement sensor. The signals from the sensor are used to identify sound information or characteristics of sounds made by a source of noise, and the audio signal of the microphone is modified to reduce unwanted sounds based on that sound information or based on sounds identified a second audio signal obtained by the second microphone, thereby improving teleconference and video conference audio quality and removing distracting noises from transmitted audio output.

Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.