Patents by Inventor Edward W. Rutter, Jr.
Edward W. Rutter, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11881337Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.Type: GrantFiled: November 23, 2018Date of Patent: January 23, 2024Assignee: Littelfuse Electronics (Shanghai) Co., Ltd.Inventors: Jianhua Chen, Chun-Kwan Tsang, Zhiyong Zhou, Yingsong Fu, Edward W. Rutter, Jr.
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Patent number: 11309484Abstract: A device may include an inner layer comprising a polyvinylidene fluoride (PVDF) material. The device may also include a first interface layer, disposed on a first side of the inner layer, and a second interface layer, disposed on a second side of the inner layer. The first interface layer and the second interface layer may comprise a mixture of PVDF material and a scavenger component.Type: GrantFiled: January 13, 2019Date of Patent: April 19, 2022Assignee: Littelfuse, Inc.Inventors: Yuriy B. Matus, Martin Pineda, Edward W. Rutter, Jr.
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Publication number: 20220013259Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.Type: ApplicationFiled: November 23, 2018Publication date: January 13, 2022Applicant: Littelfuse Electronics (Shanghai) Co., Ltd.Inventors: Jianhua Chen, Chun-Kwan Tsang, Zhiyong Zhou, Yingsong Fu, Edward W. Rutter, Jr.
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Patent number: 10902983Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.Type: GrantFiled: July 29, 2020Date of Patent: January 26, 2021Assignee: Littelfuse, Inc.Inventors: Edward W. Rutter, Jr., Yuriy B. Matus, Martin Pineda
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Publication number: 20200357543Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.Type: ApplicationFiled: July 29, 2020Publication date: November 12, 2020Applicant: Littelfuse, Inc.Inventors: Edward W. Rutter, JR., Yuriy B. Matus, Martin Pineda
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Patent number: 10784026Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.Type: GrantFiled: January 20, 2019Date of Patent: September 22, 2020Assignee: Littelfuse, Inc.Inventors: Edward W. Rutter, Jr., Yuriy B. Matus, Martin Pineda
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Publication number: 20200234857Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.Type: ApplicationFiled: January 20, 2019Publication date: July 23, 2020Applicant: LITTELFUSE, INC.Inventors: Edward W. Rutter, JR., Yuriy B. Matus, Martin Pineda
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Publication number: 20200227622Abstract: A device may include an inner layer comprising a polyvinylidene fluoride (PVDF) material. The device may also include a first interface layer, disposed on a first side of the inner layer, and a second interface layer, disposed on a second side of the inner layer. The first interface layer and the second interface layer may comprise a mixture of PVDF material and a scavenger component.Type: ApplicationFiled: January 13, 2019Publication date: July 16, 2020Applicant: Littelfuse, Inc.Inventors: Yuriy B. Matus, Martin Pineda, Edward W. Rutter, JR.
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Publication number: 20170004946Abstract: Conductive composite compositions and circuit protection devices including a conductive composite composition are disclosed. The conductive composite composition includes a polymer material, a plurality of conductive particles, and a high melting point additive. The high melting point additive comprises at least 1% of the conductive composite, by volume of the total composition. The circuit protection device includes a body portion comprising a conductive composite composition, the conductive composite composition comprising a polymer material, a plurality of conductive particles, and at least 1%, by volume, of a high melting point additive loaded in the polymer material, and leads extending from the body portion, the leads arranged and disposed to electrically couple the circuit protection device to an electrical system. Also provided is a method of forming a conductive composite.Type: ApplicationFiled: June 30, 2015Publication date: January 5, 2017Applicant: Tyco Electronics CorporationInventors: Edward W. Rutter, JR., Ann O. Banich, Jaydip Das, Chun-Kwan Tsang, Kavitha Bharadwaj, Ting Gao, Jianhua Chen, James Toth
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Patent number: 8629294Abstract: Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants are provided herein. In an embodiment, a borate ester comprises boron and silicon wherein the boron is linked to the silicon by alkyl groups that are bonded via ester bonds with both the boron and the silicon. A method of fabricating a boron-comprising dopant comprises providing a borate and transesterifying the borate using a polyol-substituted silicon monomer.Type: GrantFiled: August 25, 2011Date of Patent: January 14, 2014Assignee: Honeywell International Inc.Inventors: Richard A. Spear, Edward W. Rutter, Jr., Lea M. Metin, Helen X. Xu
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Publication number: 20130048918Abstract: Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants are provided herein. In an embodiment, a borate ester comprises boron and silicon wherein the boron is linked to the silicon by alkyl groups that are bonded via ester bonds with both the boron and the silicon. A method of fabricating a boron-comprising dopant comprises providing a borate and transesterifying the borate using a polyol-substituted silicon monomer.Type: ApplicationFiled: August 25, 2011Publication date: February 28, 2013Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Richard A. Spear, Edward W. Rutter, JR., Lea M. Metin, Helen X. Xu
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Patent number: 6878500Abstract: Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.Type: GrantFiled: April 5, 2003Date of Patent: April 12, 2005Assignee: Marlborough,Inventors: Edward W. Rutter, Jr., Cuong Manh Tran, Edward C. Orr
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Patent number: 6749765Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.Type: GrantFiled: March 27, 2002Date of Patent: June 15, 2004Assignee: Shipley Company, L.L.C.Inventors: Edward W. Rutter, Jr., Peter Trefonas, III, Edward K. Pavelchek
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Patent number: 6610609Abstract: Disclosed are compositions and methods for improving compatibility of imaging layers with dielectric layers. Also disclosed are methods of reducing or eliminating poisoning of photoresists during electronic device manufacture.Type: GrantFiled: May 2, 2001Date of Patent: August 26, 2003Assignee: Shipley Company, L.L.C.Inventors: Edward W. Rutter, Jr., Leo L. Linehan
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Patent number: 6461717Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.Type: GrantFiled: April 24, 2000Date of Patent: October 8, 2002Assignee: Shipley Company, L.L.C.Inventors: Edward W. Rutter, Jr., Peter Trefonas, III, Edward K. Pavelchek
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Patent number: 6319835Abstract: Disclosed are compositions useful for removing antireflective compositions from a substrate. Also disclosed are methods of removing antireflective compositions from a substrate using such compositions.Type: GrantFiled: February 25, 2000Date of Patent: November 20, 2001Assignee: Shipley Company, L.L.C.Inventors: Javad J. Sahbari, Edward W. Rutter, Jr., Jeffrey M. Calvert
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Patent number: 6083661Abstract: Photodefineable cyclobutarene compositions are disclosed. These polymer compositions are useful in composites, laminates, membranes, films, adhesives, coatings, and electronic applications such as multichip modules and printed circuit boards. An example of such photodefineable cyclobutarene compositions is a mixture of a photosensitive agent such as 2,6-bis(4-azidobenzylidene)-4-methylcyclohexanone and a cyclobutarene such as oligomeric divinyltetramethyldisiloxane bisbenzocyclobutane.Type: GrantFiled: August 15, 1994Date of Patent: July 4, 2000Assignee: The Dow Chemical CompanyInventors: Frank L. Oaks, Eric S. Moyer, Edward W. Rutter, Jr., Robert F. Harris
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Patent number: 5882836Abstract: A photocurable formulation containing a partially polymerized DVS resin formed by heating DVS monomer (1,3-bis(2-bicyclo?4.2.0!octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyl disiloxane) in a solvent at an initial concentration of DVS monomer in the solvent of from about 12 to about 32 weight percent. This photocurable formulation may be used as an interlayer dielectric to fabricate thin film multichip modules.Type: GrantFiled: June 5, 1995Date of Patent: March 16, 1999Assignee: The Dow Chemical CompanyInventors: Pamela S. Foster, Ernest L. Ecker, Edward W. Rutter, Jr., Eric S. Moyer
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Patent number: 5854302Abstract: A process for forming a partially polymerized DVS resin comprising heating DVS monomer (1,3-bis(2-bicyclo?4.2.0!octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyl disiloxane) in a solvent at a concentration of DVS monomer in the solvent such that:(a) the DVS resin, when applied and polymerized in a thin layer on a solid substrate does not craze; and(b) the DVS resin, is rendered photocurable by the addition of at least one photosensitive agent in an amount sufficient to convert the mixture to an organic-insoluble solid upon exposing the mixture to photon radiation and the film retention upon development with a solvent is at least 50 percent. The DVS resin may be used as an interlayer dielectric to fabricate thin film multichip modules.Type: GrantFiled: April 14, 1994Date of Patent: December 29, 1998Assignee: The Dow Chemical CompanyInventors: Pamela S. Foster, Ernest L. Ecker, Edward W. Rutter, Jr., Eric S. Moyer
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Patent number: 5585450Abstract: An oligomerized cyclobutarene containing 80 weight percent or more of oligomers of a degree of polymerization of three or more.Type: GrantFiled: June 5, 1995Date of Patent: December 17, 1996Assignee: The Dow Chemical CompanyInventors: Frank L. Oaks, Eric S. Moyer, Edward W. Rutter, Jr., Robert F. Harris