Patents by Inventor Edwin B. RAMAYYA

Edwin B. RAMAYYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated thermoelectric cooling
    Patent number: 10825752
    Abstract: Embodiments of the present disclosure describe techniques and configurations for integrated thermoelectric cooling. In one embodiment, a cooling assembly includes a semiconductor substrate, first circuitry disposed on the semiconductor substrate and configured to generate heat when in operation and second circuitry disposed on the semiconductor substrate and configured to remove the heat by thermoelectric cooling. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: November 3, 2020
    Assignee: Intel Corporation
    Inventors: Lei Jiang, Edwin B. Ramayya, Daniel Pantuso, Rafael Rios, Kelin J. Kuhn, Seiyon Kim
  • INTEGRATED THERMOELECTRIC COOLING
    Publication number: 20160027717
    Abstract: Embodiments of the present disclosure describe techniques and configurations for integrated thermoelectric cooling. In one embodiment, a cooling assembly includes a semiconductor substrate, first circuitry disposed on the semiconductor substrate and configured to generate heat when in operation and second circuitry disposed on the semiconductor substrate and configured to remove the heat by thermoelectric cooling. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 18, 2013
    Publication date: January 28, 2016
    Inventors: Lei JIANG, Edwin B. RAMAYYA, Daniel PANTUSO, Rafael RIOS, Kelin J. KUHN, Selyon KIM