Patents by Inventor Edwin Keshesh Yousafian

Edwin Keshesh Yousafian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9846091
    Abstract: Certain example embodiments include a press sensor element that includes a piezoelectric layer having a first surface in communication with a first layer, the first layer including a first conductive region, where the first conductive region covers at least a central portion the first surface. The sensor element includes a second surface in communication with a second layer, the second layer including a second conductive region, a third conductive region, and a first non-conductive void region separating the second conductive region and the third conductive region. An area of the first conductive region is configured in size relative to an area of the third conductive region to substantially reduce a thermally-induced voltage change between two or more of the first, second, and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: December 19, 2017
    Assignee: INTERLINK ELECTRONICS, INC.
    Inventors: Chee Wai Lu, Jeffrey R. Baker, Edwin Keshesh Yousafian, Declan Christopher Flannery
  • Publication number: 20170131160
    Abstract: Certain example embodiments include a press sensor element that includes a piezoelectric layer having a first surface in communication with a first layer, the first layer including a first conductive region, where the first conductive region covers at least a central portion the first surface. The sensor element includes a second surface in communication with a second layer, the second layer including a second conductive region, a third conductive region, and a first non-conductive void region separating the second conductive region and the third conductive region. An area of the first conductive region is configured in size relative to an area of the third conductive region to substantially reduce a thermally-induced voltage change between two or more of the first, second, and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.
    Type: Application
    Filed: January 10, 2017
    Publication date: May 11, 2017
    Inventors: Chee Wai Lu, Jeffrey R. Baker, Edwin Keshesh Yousafian, Declan Christopher Flannery
  • Patent number: 9574954
    Abstract: Certain example embodiments include a press sensor element that includes a piezoelectric layer having a first surface in communication with a first layer, the first layer including a first conductive region, where the first conductive region covers at least a central portion the first surface. The sensor element includes a second surface in communication with a second layer, the second layer including a second conductive region, a third conductive region, and a first non-conductive void region separating the second conductive region and the third conductive region. An area of the first conductive region is configured in size relative to an area of the third conductive region to substantially reduce a thermally-induced voltage change between two or more of the first, second, and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: February 21, 2017
    Assignee: INTERLINK ELECTRONICS, INC.
    Inventors: Jeffrey R. Baker, Edwin Keshesh Yousafian, Declan Christopher Flannery
  • Publication number: 20160131542
    Abstract: Certain example embodiments include a press sensor element that includes a piezoelectric layer having a first surface in communication with a first layer, the first layer including a first conductive region, where the first conductive region covers at least a central portion the first surface. The sensor element includes a second surface in communication with a second layer, the second layer including a second conductive region, a third conductive region, and a first non-conductive void region separating the second conductive region and the third conductive region. An area of the first conductive region is configured in size relative to an area of the third conductive region to substantially reduce a thermally-induced voltage change between two or more of the first, second, and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.
    Type: Application
    Filed: January 5, 2016
    Publication date: May 12, 2016
    Inventors: Jeffrey R. Baker, Edwin Keshesh Yousafian, Declan Christopher Flannery
  • Patent number: 9261418
    Abstract: Certain implementations of the disclosed technology may include systems, methods, and apparatus for common mode signal cancellation in force change detectors. An example embodiment of the disclosed technology includes a press sensor element configured to reduce or eliminate thermally induced signals. The sensor element includes a piezoelectric layer that includes a first surface in communication with a first layer. The first layer includes a first conductive region. The piezoelectric layer includes a second surface in communication with a second layer. The second layer includes a second conductive region, a third conductive region, and a non-conductive void region separating the second conductive region and the third conductive region.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: February 16, 2016
    Assignee: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Edwin Keshesh Yousafian, Declan Christopher Flannery
  • Publication number: 20140260679
    Abstract: Certain implementations of the disclosed technology may include systems, methods, and apparatus for common mode signal cancellation in force change detectors. An example embodiment of the disclosed technology includes a press sensor element configured to reduce or eliminate thermally induced signals. The sensor element includes a piezoelectric layer that includes a first surface in communication with a first layer. The first layer includes a first conductive region. The piezoelectric layer includes a second surface in communication with a second layer. The second layer includes a second conductive region, a third conductive region, and a non-conductive void region separating the second conductive region and the third conductive region.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 18, 2014
    Applicant: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Edwin Keshesh Yousafian, Declan Christopher Flannery