Abstract: This present disclosure seals the light propagation path in an optical interconnection element from external contaminants. The optical interconnection element includes a reflective surface, which can also be sealed from external contaminants Additional novel concepts include all enclosed sealed regions of the optical interconnection element being fluidly connected and making the final seal of the optical interconnection element with a thin plate, which can bend reducing the pressure differential between the ambient environment and the sealed internal volume of the optical interconnection element.

Abstract: A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.

Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.

Abstract: A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.

Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.

Abstract: A module for coupling to a fiber-optic cable includes an optoelectronic assembly that includes a bracket and a metal receptacle. The metal receptacle includes an attachment member operable to releasably connect the receptacle to the bracket, an alignment end operable to receive an alignment device, and a connector end operable to releasably connect to the fiber-optic cable and to orient the cable with the alignment device. The metal receptacle can suppress EMI and can typically withstand higher temperatures than most plastic materials. Thus, when subject to high temperatures, the receptacle typically will not expel gas that can fog a lens or deform. The attachment member allows one to releasably connect the receptacle to an optoelectronic assembly without fixing the receptacle to the assembly with adhesive. Thus, the receptacle can be mounted to an optoelectronic assembly quickly and without an alignment fixture.

Abstract: A module for coupling to a fiber-optic cable includes an optoelectronic assembly that includes a bracket and a metal receptacle. The metal receptacle includes an attachment member operable to releasably connect the receptacle to the bracket, an alignment end operable to receive an alignment device, and a connector end operable to releasably connect to the fiber-optic cable and to orient the cable with the alignment device. The metal receptacle can suppress EMI and can typically withstand higher temperatures than most plastic materials. Thus, when subject to high temperatures, the receptacle typically will not expel gas that can fog a lens or deform. The attachment member allows one to releasably connect the receptacle to an optoelectronic assembly without fixing the receptacle to the assembly with adhesive. Thus, the receptacle can be mounted to an optoelectronic assembly quickly and without an alignment fixture.

Abstract: A module for coupling to a fiber-optic cable includes an optoelectronic assembly that includes a bracket and a metal receptacle. The metal receptacle includes an attachment member operable to releasably connect the receptacle to the bracket, an alignment end operable to receive an alignment device, and a connector end operable to releasably connect to the fiber-optic cable and to orient the cable with the alignment device. The metal receptacle can suppress EMI and can typically withstand higher temperatures than most plastic materials. Thus, when subject to high temperatures, the receptacle typically will not expel gas that can fog a lens or deform. The attachment member allows one to releasably connect the receptacle to an optoelectronic assembly without fixing the receptacle to the assembly with adhesive. Thus, the receptacle can be mounted to an optoelectronic assembly quickly and without an alignment fixture.

Abstract: A module for coupling to a fiber-optic cable includes an optoelectronic assembly that includes a bracket and a metal receptacle. The metal receptacle includes an attachment member operable to releasably connect the receptacle to the bracket, an alignment end operable to receive an alignment device, and a connector end operable to releasably connect to the fiber-optic cable and to orient the cable with the alignment device. The metal receptacle can suppress EMI and can typically withstand higher temperatures than most plastic materials. Thus, when subject to high temperatures, the receptacle typically will not expel gas that can fog a lens or deform. The attachment member allows one to releasably connect the receptacle to an optoelectronic assembly without fixing the receptacle to the assembly with adhesive. Thus, the receptacle can be mounted to an optoelectronic assembly quickly and without an alignment fixture.