Patents by Inventor Edwin W. Bastenbeck

Edwin W. Bastenbeck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for electroless copper deposition on laser-direct structured substrates
    Patent number: 9538665
    Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: January 3, 2017
    Inventors: Edwin W. Bastenbeck, Harald Orschel, Ulrich Prinz
  • AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOSITION ON LASER-DIRECT STRUCTURED SUBSTRATES
    Publication number: 20140255600
    Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.
    Type: Application
    Filed: October 10, 2012
    Publication date: September 11, 2014
    Applicant: ENTHONE INC.
    Inventors: Edwin W. Bastenbeck, Harald Orschel, Ulrich Prinz
  • Composition and process for conditioning the surface of polycarbonate resins prior to metal plating
    Patent number: 4775557
    Abstract: A process for specially conditioning and etching a polycarbonate resin prior to metal plating to enhance the coverage and adhesiveness of metal plating to the resin. The swellant composition comprises a compound represented by the general formula,R.sub.1 (OC.sub.n H.sub.2n).sub.m O--R.sub.2wherein R.sub.1 and R.sub.2 are independently selected from the group consisting of aryl groups and alkyl groups of 1-4 carbon atoms, n is 2 to 4 and m is 1 to 5.The swelled resin is then etched using, preferably, a highly alkaline composition such as a solution containing greater than about 100 g/l NaOH. Other etchants such as chromic acid may also be used.The resin is now ready for plating using conventional techniques.
    Type: Grant
    Filed: November 9, 1987
    Date of Patent: October 4, 1988
    Assignee: Enthone, Incorporated
    Inventors: Edwin W. Bastenbeck, Juan Haydu, Richard A. Bellemare, Jr.
  • RFI shielded plastic articles and process for making same
    Patent number: 4663240
    Abstract: An RFI shielded enclosure and a process for making same are disclosed. The process comprises coating at least one surface of the enclosure with a fluid organic binder having a substantial percentage of catalytic particles suspended therein. The particles used cause the electroless deposition of copper or nickel to produce an RFI shielded enclosure having in excess of 40 dB's shielding at frequencies above 10 kiloHertz.
    Type: Grant
    Filed: November 6, 1984
    Date of Patent: May 5, 1987
    Assignee: Enthone, Incorporated
    Inventors: Juan B. Hajdu, Edwin W. Bastenbeck
  • Selective nickel stripping compositions and method of stripping
    Patent number: 4554049
    Abstract: Stripping solutions comprising hydrogen peroxide and sulfamic acid in correlated amounts are effective for the rapid and selective removal of nickel from mild steel surfaces and nickel, nickel alloy and nickel reaction products from alloy substrates. The compositions contain sulfamate, nitrate and chloride and peroxide ions and, preferably, an iron complexing agent such as ethylene diamine tetraacetic acid.
    Type: Grant
    Filed: June 7, 1984
    Date of Patent: November 19, 1985
    Assignee: Enthone, Incorporated
    Inventor: Edwin W. Bastenbeck