Abstract: A method and apparatus for imaging an overlying conductive pattern over an underlying conductive pattern on a substrate, by determining deviations between the actual locations and the nominal locations of predetermined reference targets in the underlying conductive pattern on the substrate; and utilizing the determined deviations for modifying the scanning control data used for imaging the image data of the overlying conductive pattern in order to reduce misregistration thereof with respect to the underlying conductive pattern. Preferably, the reference targets are predetermined connection sites in the underlying conductive pattern to be precisely located with respect to connection sites in the overlying conductive pattern. The reference features may be assigned different weights according to their registration importance, and the deviations may be determined according to a threshold which varies with the weight assigned to the respective reference feature.

Abstract: A method and apparatus for imaging an overlying conductive pattern over an underlying conductive pattern on a substrate, by determining deviations between the actual locations and the nominal locations of predetermined reference targets in the underlying conductive pattern on the substrate; and utilizing the determined deviations for modifying the scanning control data used for imaging the image data of the overlying conductive pattern in order to reduce misregistration thereof with respect to the underlying conductive pattern. Preferably, the reference targets are predetermined connection sites in the underlying conductive pattern to be precisely located with respect to connection sites in the overlying conductive pattern. The reference features may be assigned different weights according to their registration importance, and the deviations may be determined according to a threshold which varies with the weight assigned to the respective reference feature.