Patents by Inventor Effrosini A. Karayiannis

Effrosini A. Karayiannis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10841687
    Abstract: A headphone apparatus includes a neckband having a first arm and a second arm joined by a central portion therebetween. The first and second arms each have a flexible section proximal to the central portion, the flexible sections including a memory material for dynamically creating and maintaining a desired shape of the neckband. The headphone apparatus further includes first and second earbuds connected to the neckband.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: November 17, 2020
    Assignee: Harman International Industries, Incorporated
    Inventors: Ryan Ott, Daniel I. Radin, Effrosini A. Karayiannis, Kent Jopling, Torry Xu
  • Patent number: 10791390
    Abstract: In at least one embodiment, a headphone apparatus including an earbud is provided. The earbud includes a housing, a flexible skirt, and a flexible tip portion. The housing includes a loudspeaker positioned therein and at least a portion of the housing being arranged to be received in a user's concha. The flexible skirt is removably coupled to at least a portion of the housing to be at least partially received in an ear canal of the user. The flexible tip portion extends from the housing and the flexible tip portion is configured to be received in at least an antihelix of the user. The flexible tip portion includes an outer wall and a rib intersecting with the outer wall such that the outer wall applies a force against the rib in response to contact with an anti-helical fold of the user's ear.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: September 29, 2020
    Assignee: Harman International Industries, Incorporated
    Inventors: Effrosini A. Karayiannis, Kim Hyo Jin, Derek Campbell
  • Publication number: 20200245049
    Abstract: In at least one embodiment, a headphone apparatus including an earbud is provided. The earbud includes a housing, a flexible skirt, and a flexible tip portion. The housing includes a loudspeaker positioned therein and at least a portion of the housing being arranged to be received in a user's concha. The flexible skirt is removably coupled to at least a portion of the housing to be at least partially received in an ear canal of the user. The flexible tip portion extends from the housing and the flexible tip portion is configured to be received in at least an antihelix of the user. The flexible tip portion includes an outer wall and a rib intersecting with the outer wall such that the outer wall applies a force against the rib in response to contact with an anti-helical fold of the user's ear.
    Type: Application
    Filed: January 25, 2019
    Publication date: July 30, 2020
    Inventors: Effrosini A. KARAYIANNIS, Kim Hyo JIN, Derek CAMPBELL
  • Publication number: 20190349659
    Abstract: A headphone apparatus includes a neckband having a first arm and a second arm joined by a central portion therebetween. The first and second arms each have a flexible section proximal to the central portion, the flexible sections including a memory material for dynamically creating and maintaining a desired shape of the neckband. The headphone apparatus further includes first and second earbuds connected to the neckband.
    Type: Application
    Filed: July 24, 2019
    Publication date: November 14, 2019
    Inventors: Ryan OTT, Daniel I. RADIN, Effrosini A. KARAYIANNIS, Kent JOPLING, Torry XU
  • Patent number: 10419839
    Abstract: A headphone apparatus includes a neckband having a first arm and a second arm joined by a central portion therebetween. The first and second arms each have a flexible section proximal to the central portion, the flexible sections including a memory material for dynamically creating and maintaining a desired shape of the neckband. The headphone apparatus further includes first and second earbuds connected to the neckband.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: September 17, 2019
    Assignee: Harman International Industries, Incorporated
    Inventors: Ryan Ott, Daniel I. Radin, Effrosini A. Karayiannis, Kent Jopling, Torry Xu
  • Publication number: 20190069064
    Abstract: A headphone apparatus includes a neckband having a first arm and a second arm joined by a central portion therebetween. The first and second arms each have a flexible section proximal to the central portion, the flexible sections including a memory material for dynamically creating and maintaining a desired shape of the neckband. The headphone apparatus further includes first and second earbuds connected to the neckband.
    Type: Application
    Filed: August 28, 2017
    Publication date: February 28, 2019
    Inventors: Ryan OTT, Dan RADIN, Effrosini A. KARAYIANNIS, Kent JOPLING, Torry XU
  • Patent number: 10194233
    Abstract: An earphone with a physiologic sensor includes a housing; a speaker in the housing; an enhancer comprising a body mounted on the housing and adapted to be secured in the ear to acoustically couple the speaker to the user's ear; and an optical physiologic sensor disposed inside the enhancer, the enhancer having an aperture or window aligned with the optical physiologic sensor, so that the sensor can optically couple with the user's ear when the enhancer is secured in the user's ear.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: January 29, 2019
    Assignee: Harman International Industries, Incorporated
    Inventors: Seth D. Burgett, Aaron Gorga, Effrosini A. Karayiannis
  • Publication number: 20170127174
    Abstract: An earphone with a physiologic sensor includes a housing; a speaker in the housing; an enhancer comprising a body mounted on the housing and adapted to be secured in the ear to acoustically couple the speaker to the user's ear; and an optical physiologic sensor disposed inside the enhancer, the enhancer having an aperture or window aligned with the optical physiologic sensor, so that the sensor can optically couple with the user's ear when the enhancer is secured in the user's ear.
    Type: Application
    Filed: January 17, 2017
    Publication date: May 4, 2017
    Inventors: Seth D. BURGETT, Aaron GORGA, Effrosini A. KARAYIANNIS
  • Patent number: 9591395
    Abstract: An earphone with a physiologic sensor includes a housing; a speaker in the housing; an enhancer comprising a body mounted on the housing and adapted to be secured in the ear to acoustically couple the speaker to the user's ear; and an optical physiologic sensor disposed inside the enhancer, the enhancer having an aperture or window aligned with the optical physiologic sensor, so that the sensor can optically couple with the user's ear when the enhancer is secured in the user's ear.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: March 7, 2017
    Assignee: Harman International Industries, Incorporated
    Inventors: Seth D. Burgett, Aaron Gorga, Effrosini A. Karayiannis
  • Patent number: D773435
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: December 6, 2016
    Assignee: Harman International Industries, Incorporated
    Inventors: Ryan Ott, Eric Sia, Effrosini Karayiannis
  • Patent number: D796485
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: September 5, 2017
    Assignee: Harman International Industries, Incorporated
    Inventors: Eric Sia, Ryan Ott, Effrosini Karayiannis
  • Patent number: D806059
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: December 26, 2017
    Assignee: Harman International Industries, Incorporated
    Inventors: Ryan Ott, Eric Sia, Effrosini A Karayiannis
  • Patent number: D852165
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: June 25, 2019
    Assignee: Harman International Industries, Incorporated
    Inventors: Effrosini A. Karayiannis, Daniel I. Radin, Ryan Ott
  • Patent number: D853351
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: July 9, 2019
    Assignee: Harman International Industries, Incorporated
    Inventors: Ryan Ott, Effrosini A. Karayiannis, Daniel I. Radin, Yanyao He
  • Patent number: D867329
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 19, 2019
    Assignee: Harman International Industries, Incorporated
    Inventors: Effrosini A. Karayiannis, Daniel I. Radin, Ryan Ott
  • Patent number: D870711
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: December 24, 2019
    Assignee: Harman International Industries, Incorporated
    Inventors: Effrosini A. Karayiannis, Hyo Jin Kim, Derek Campbell
  • Patent number: D871374
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: December 31, 2019
    Assignee: Harman International Industries, Incorporated
    Inventors: Effrosini A. Karayiannis, Ryan Ott
  • Patent number: D892089
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: August 4, 2020
    Assignee: Harman International Industries, Incorporated
    Inventors: Effrosini A. Karayiannis, Ryan Ott, Yanyao He, Derek Campbell
  • Patent number: D901178
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: November 10, 2020
    Assignee: Harman International Industries, Incorporated
    Inventors: Hyo Jin Kim, Effrosini A. Karayiannis, Derek Campbell
  • Patent number: D944762
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: March 1, 2022
    Assignee: Harman International Industries, Incorporated
    Inventors: Jieyu Chen, Rafal Mateusz Czaniecki, Effrosini A. Karayiannis