Abstract: An electronic device module including a glass cover sheet, a polymeric front polymeric material, an electronic device, a polymeric back material and a backsheet, wherein the polymeric front and/or back materials have a trilayer structure including a back layer which is adhered to a surface of the electronic device, a front layer which is adhered to the glass cover sheet or the backsheet and an intermediate layer between the back layer and the front layer, wherein each of the back layer and the front layer includes an ethylene interpolymer grafted with silane, wherein the ethylene interpolymer grafted with silane has a density of at most 0.905 g/cm3, and the intermediate layer is a non-grafted ethylene interpolymer having a density of at most 0.905 g/cm3, which is crosslinked with the aid of a crosslinking initiator and optionally a crosslinking coagent, and optionally additives.

Abstract: An electronic device module including a glass cover sheet, a polymeric front polymeric material, an electronic device, a polymeric back material and a backsheet, wherein the polymeric front and/or back materials have a trilayer structure including a back layer which is adhered to a surface of the electronic device, a front layer which is adhered to the glass cover sheet or the backsheet and an intermediate layer between the back layer and the front layer, wherein each of the back layer and the front layer includes an ethylene interpolymer grafted with silane, wherein the ethylene interpolymer grafted with silane has a density of at most 0.905 g/cm3, and the intermediate layer is a non-grafted ethylene interpolymer having a density of at most 0.905 g/cm3, which is crosslinked with the aid of a crosslinking initiator and optionally a crosslinking coagent, and optionally additives.