Patents by Inventor Egidio E. Marotta

Egidio E. Marotta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090320953
    Abstract: An interstitially insulated pipeline for flowing a hydrocarbon. In an embodiment, the pipeline comprises a first interstitially insulated pipe and a second interstitially insulated pipe. Each interstitially insulated pipe comprises an inner pipe, an outer pipe mounted coaxially around the inner pipe, an insulating interstice radially positioned between the inner pipe and the outer pipe, and a layer of screen mesh having a mesh size 10 or less disposed in the insulating interstice. In addition, the pipeline comprises a joint coupling the first interstitially insulated tubular and the second interstitially insulated tubular end-to-end. The joint includes a connection that couples the outer pipe of the first interstitially insulated pipe to the outer pipe of the second interstitially insulated pipe, and an annular seal member disposed between the inner pipe of the first interstitially insulated pipe and the inner pipe of the second interstitially insulated pipe.
    Type: Application
    Filed: April 30, 2007
    Publication date: December 31, 2009
    Applicant: THE TEXAS A&M UNIVERSITY SYSTEM
    Inventors: Leroy S. Fletcher, Egidio E. Marotta, Charles A. Bollfrass
  • Patent number: 7085135
    Abstract: A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: August 1, 2006
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Egidio E. Marotta, Prabjit Singh