Abstract: Solar cells, where at least one conductor is mechanically and electrically connected to the solar cell and/or further conductors by conductive cladding. The conductive cladding is preferably deposited electrolytically or galvanically from solution or is produced by plasma-spraying. In addition, methods for connecting solar cells by means of at least one conductor and/or for connecting conductors on solar cells, wherein at least one electrically-conductive conductor is mechanically and electrically connected by depositing conductive cladding from solution onto the solar cell and/or at least one conductor.

Abstract: The subject matter is directed to electrical contacting of band- or plate-shaped materials (1), which are conveyed by transport track through an electroplating system. The cathodically polarized contact means (6) may be located on the underside of the material (1) in the electrolyte (12) circulated in the electroplating system. The material is electrically contacted to transfer current to the material (1). Each tubular contact means (6) is cooled by means of a cooling unit or a cooling medium. No metal is deposited on the cooled surface of the contact means (6) if the temperature difference between the working temperature of the electrolyte (12) and the surface temperature of the contact means (6) is sufficiently large. This property can be supplemented with a surface of the contact means (6) that cannot be cathodically metal-coated in the electrolyte (12) used.

Abstract: A method and a device for electroplating and electrolytically etching plate-shaped or strip-shaped material in continuous installations or bath installations having rotating transport and contact structures along the conveyor belt. The current is fed to the material in the center, i.e. in the useful zone, thereby obtaining a layer thickness distribution which is at least as good as when the current is supplied from both edges. The invention further allows material of any formats of width and different contours to be electrolytically treated in any order.

Abstract: In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for bringing treatment liquid into contact with the workpieces 9, means 10 for electrical contracting of the workpieces 9 at contacting sites and counterelectrodes 5.x which are so arranged that the workpieces 9 may be arranged opposing them, whereby the counterelectrodes 5.x are each subdivided into at least two electrode segments 13.x such that at least one contact-near electrode segment 13.1 and at least one contact-remote electrode segment 13.4 and possibly further electrode segments 13.2, 13.3 arranged between them are provided and each electrode segment 13.x is fed by a separate current source 15.x.

Abstract: To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.