Patents by Inventor Eiichi Kawashima

Eiichi Kawashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7611766
    Abstract: A wafer protective sheet 1 is made of a synthetic resin sheet with a thickness of 80 to 130 ?m having a large number of projected parts and recessed parts on its front and rear surfaces. The large number of projected parts and the large number of recessed parts are respectively disposed so that each part is positioned at intersections of lattice stripes, and the projected part and the recessed part are disposed alternately each other. The sheet has such a water-like cross section that the recessed parts in the rear surface match the projected parts on the front surface and the projected parts on the rear surface match the recessed parts in the front surface. The wafer protective sheet 1 has a bending resistance of 30 to 80 mm. The wafer protective sheet 1 of the present invention is sufficiently thin. When the wafer protective sheets are interposed between stacked wafers to protect them, the sheets do not adhere to the wafers.
    Type: Grant
    Filed: April 8, 2004
    Date of Patent: November 3, 2009
    Assignee: Achilles Corporation
    Inventors: Masahiko Fuyumuro, Yoshitaka Nakayama, Eiichi Kawashima
  • Publication number: 20060237343
    Abstract: A wafer protective sheet 1 is made of a synthetic resin sheet with a thickness of 80 to 130 ?m having a large number of projected parts and recessed parts on its front and rear surfaces. The large number of projected parts and the large number of recessed parts are respectively disposed so that each part is positioned at intersections of lattice stripes, and the projected part and the recessed part are disposed alternately each other. The sheet has such a water-like cross section that the recessed parts in the rear surface match the projected parts on the front surface and the projected parts on the rear surface match the recessed parts in the front surface. The wafer protective sheet 1 has a bending resistance of 30 to 80 mm. The wafer protective sheet 1 of the present invention is sufficiently thin. When the wafer protective sheets are interposed between stacked wafers to protect them, the sheets do not adhere to the wafers.
    Type: Application
    Filed: April 8, 2004
    Publication date: October 26, 2006
    Inventors: Masahiko Fuyumuro, Yoshitaka Nakayama, Eiichi Kawashima
  • Patent number: 5173178
    Abstract: An under-sink type water purifier with a water-tap portion connected to a purified-water outlet of the purifier having a sensor for sensing an object to issue a signal, and a solenoid valve for starting and stopping the discharge of purified water from the water-tap portion in response to the signal. The apparatus is characterized by a control circuit for opening and closing the valve in response to the signal. The circuit is provided with at least one of a first timer for opening the valve at every preset time for a short time, and a second timer for opening the valve for a short time to permit the water-tap portion to discharge the purified water therefrom when the purified water remains confined in the purifier for a predetermined period of time. These timers are selectively used in operation.
    Type: Grant
    Filed: September 24, 1991
    Date of Patent: December 22, 1992
    Assignee: Osaki Electric Co., Ltd.
    Inventors: Eiichi Kawashima, Kyohei Shinozaki