Patents by Inventor Eiichi KUROSAKI

Eiichi KUROSAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097540
    Abstract: A heating device 10 for laminated iron core has a laminated iron core 18 as an object to be processed, and performs a heat treatment on an adhesive agent applied to the iron core 18. The device 10 includes a center guide 24, and the center guide 24 is an outer diameter variable chuck mechanism of which an outer diameter is variable.
    Type: Application
    Filed: November 9, 2021
    Publication date: March 21, 2024
    Inventors: Eiichi KUROSAKI, Yuuma ITOU, Syuichi UEDA, Norio KAWAMI
  • Publication number: 20240025165
    Abstract: In FIG. 7A, thin steel sheets 17 inside a fixed squeeze 42 continue to descend. Once a thin steel sheet 17 (n) passes a lower end of a first movable squeeze 54, the first movable squeeze 54 is closed. In FIG. 7B, once the thin steel sheet 17 (n) passes a lower end of a second movable squeeze 55, the second movable squeeze 55 is closed. In FIG. 7C, a laminate 50 is dispensed from a backup 43. There is provided a laminate dispensing technique that allows the thin steel sheets inside the fixed squeeze to continue to descend even during dispensing by enabling the continuous descent of the thin steel sheets 17 inside the fixed squeeze 42 and the first movable squeeze 54 and the second movable squeeze 55 during this period.
    Type: Application
    Filed: July 11, 2023
    Publication date: January 25, 2024
    Inventor: Eiichi KUROSAKI
  • Patent number: 11819875
    Abstract: Provided is an adhesive application system configured to apply a necessary and sufficient amount of an adhesive to a thin steel strip without causing an increase in the equipment cost. The adhesive application system comprises an adhesive application device having adhesive dispensing nozzles (26, 27) for dispensing an adhesive to an adhesive application surface of a thin steel strip; a mechanism configured to elevate and lower the adhesive application device; and adhesive supply ports (17, 18) for supplying the adhesive at a predetermined pressure to the adhesive application device, wherein the adhesive application device has an end face that is to be brought into abutment against the thin steel strip, and wherein outlets of the adhesive dispensing nozzles (26, 27) are spaced inwardly away from the end face of the adhesive application device so that the outlets of the adhesive dispensing nozzles (26, 27) are maintained at a predetermined distance from a lower surface of the thin steel strip.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: November 21, 2023
    Assignee: TANAKA SEIMITSU KOGYO CO., LTD.
    Inventor: Eiichi Kurosaki
  • Publication number: 20230132584
    Abstract: Provided is an adhesive application system configured to apply a necessary and sufficient amount of an adhesive to a thin steel strip without causing an increase in the equipment cost. The adhesive application system comprises an adhesive application device having adhesive dispensing nozzles (26, 27) for dispensing an adhesive to an adhesive application surface of a thin steel strip; a mechanism configured to elevate and lower the adhesive application device; and adhesive supply ports (17, 18) for supplying the adhesive at a predetermined pressure to the adhesive application device, wherein the adhesive application device has an end face that is to be brought into abutment against the thin steel strip, and wherein outlets of the adhesive dispensing nozzles (26, 27) are spaced inwardly away from the end face of the adhesive application device so that the outlets of the adhesive dispensing nozzles (26, 27) are maintained at a predetermined distance from a lower surface of the thin steel strip.
    Type: Application
    Filed: March 10, 2021
    Publication date: May 4, 2023
    Applicant: TANAKA SEIMITSU KOGYO CO., LTD.
    Inventor: Eiichi KUROSAKI
  • Publication number: 20230048712
    Abstract: The present invention provides an adhesive application device configured to apply a necessary and sufficient amount of an adhesive to a thin steel strip without causing the problem of increase in the equipment cost. The present invention also provides an apparatus for producing a laminated steel core having the adhesive application device. The present invention further provides a method for producing a laminated steel core. The adhesive application device comprises adhesive application devices (3), (4) that are integrated into a single process, wherein the adhesive application devices (3), (4) are configured to independently apply an adhesive to different locations on the same surface of a thin steel strip (2) at the same or different timings.
    Type: Application
    Filed: January 15, 2021
    Publication date: February 16, 2023
    Applicant: TANAKA SEIMITSU KOGYO CO., LTD.
    Inventor: Eiichi KUROSAKI
  • Publication number: 20220393558
    Abstract: The present invention provides an apparatus for producing a laminated steel core, which is capable of punching out steel core sheets having a predetermined shape from a thin steel strip while stably supporting the thin steel strip. The present invention also provides a method for producing a laminated steel core. A support 23a provided in a lower die 21 supports a thin steel strip 22 from its bottom and extends across the width of the thin steel strip and in the feed direction of the thin steel strip.
    Type: Application
    Filed: November 16, 2020
    Publication date: December 8, 2022
    Inventor: Eiichi KUROSAKI
  • Patent number: 10953427
    Abstract: Provided are an adhesive application device and method used in the production of a laminated core, wherein the device and method are capable of stably applying an adhesive to a thin steel strip regardless of the transfer speed of the thin steel strip that is to be punched, and contribute to the improvement of the productivity of a laminated core.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: March 23, 2021
    Assignee: TANAKA SEIMITSU KOGYO CO., LTD.
    Inventor: Eiichi Kurosaki
  • Publication number: 20210031227
    Abstract: Provided are an adhesive application device and method used in the production of a laminated core, wherein the device and method are capable of stably applying an adhesive to a thin steel strip regardless of the transfer speed of the thin steel strip that is to be punched, and contribute to the improvement of the productivity of a laminated core.
    Type: Application
    Filed: February 27, 2019
    Publication date: February 4, 2021
    Applicant: TANAKA SEIMITSU KOGYO CO., LTD.
    Inventor: Eiichi KUROSAKI